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Pixel, associated image sensor, and method

A pixel and substrate technology, applied in the field of image sensors, which can solve problems such as pixel density reduction

Pending Publication Date: 2021-05-21
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This horizontal orientation limits how much the pixel density can be reduced

Method used

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  • Pixel, associated image sensor, and method
  • Pixel, associated image sensor, and method
  • Pixel, associated image sensor, and method

Examples

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Embodiment Construction

[0019] Throughout this specification, reference to "one example" or "one embodiment" means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example of the present invention. Thus, appearances of the phrases "in one example" or "in one embodiment" in various places in this specification are not necessarily all referring to the same example. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more examples.

[0020] For ease of description, spatially relative terms such as "below," "below," "bottom," "below," "above," "top," etc. may be used herein to describe an element as shown in the figures or The relationship of a feature to another element or feature. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figu...

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Abstract

A pixel includes a semiconductor substrate, a photodiode region, a floating diffusion region, and a dielectric layer. The substrate has a top surface forming a trench lined by the dielectric layer, and having a trench depth relative to a planar region of the top surface. The photodiode region is in the substrate and includes a bottom photodiode section beneath the trench and a top photodiode section adjacent to the trench, adjoining the bottom photodiode section, and extending toward the planar region to a photodiode depth less than the trench depth. The floating diffusion region is adjacent to the trench and has a junction depth less than the trench depth. A top region of the dielectric layer is between the planar region and the junction depth. A bottom region of the dielectric layer is between the photodiode depth and the trench depth, and thicker than the top region.

Description

technical field [0001] The present invention relates to the technical field of image sensors, and in particular, to a pixel, an associated image sensor and a manufacturing method thereof. Background technique [0002] Camera modules in commercial products such as stand-alone digital cameras, mobile devices, automotive components, and medical devices include image sensors and pixel arrays thereof. The pixel array includes a plurality of pixels. The pixel density of a pixel array is the number of pixels per unit area on an image sensor. In operation, the lens of the camera module forms an image of an object in its field of view on the image sensor. Objects can be viewed as multiple infinitely small sources of illumination - "pulses" - incident on the camera. The lens images each of the plurality of pulses as a corresponding one of a plurality of point spread functions - "impulse responses" at the plane of the pixel array. The resolution of an image captured by an image sen...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14603H01L27/14605H01L27/1463H01L27/14632H01L27/14643H01L27/14687H01L29/4236H01L29/66666H01L29/7827H01L27/14614H01L27/1461H01L27/14689H01L27/14645
Inventor 臧辉王勤陈刚
Owner OMNIVISION TECH INC