Robot sweeping rag ultrasonic bonding and cutting device

Abstract

The invention discloses a robot sweeping rag ultrasonic bonding and cutting device. The device comprises a device main body and a feeding frame, wherein a cutting frame, a driving seat, a bonding frame and a feeding frame are arranged at the upper end of the device main body, the bonding frame is located on one side of the feeding frame, the cutting frame is located on one side of the bonding frame, a cutting roller way is arranged on the inner side of the cutting frame, a waste chip clearing machine and a heating plate are arranged between the cutting frame and the bonding frame, and the heating plate is located at the upper end of the waste chip clearing machine. According to the robot sweeping rag ultrasonic bonding and cutting device, the ultrasonic bonding roller way, the heating plate and the waste chip clearing machine are arranged, the rag can be conveniently and better processed and treated, the heating performance is achieved, the toughness of the rag is improved, the rag is not prone to damage, the device is more durable, waste chips can be conveniently collected and treated, confusion is prevented, better use is facilitated, and better use prospects are brought.

Description

technical field [0001] The invention relates to the field of rag processing, in particular to an ultrasonic bonding and cutting device for robot sweeping rags. Background technique [0002] The rag ultrasonic bonding and cutting device is a supporting device for rag processing. It needs to be processed when making rag to improve its toughness. The process of rag processing is becoming more and more diverse. With the development of technology With continuous development, people have higher and higher requirements for the manufacturing process of the rag ultrasonic bonding and cutting device. [0003] The existing rag ultrasonic bonding and cutting device has certain disadvantages in use. First of all, it cannot be conveniently bonded to the rag during use. The process is cumbersome and the processing performance is low, which is not conducive to people's use. , In addition, the waste debris cannot be cleaned well during use, and heating is inconvenient, which brings certain ...

AI Technical Summary

Problems solved by technology

[0003] The existing rag ultrasonic bonding and cutting device has certain disadvantages in use. First of all, it cannot be conveniently bonded to the rag during use. The process is cumbersome and the processing performance is low, which is not conducive to people's use. , In addition, the waste debris cannot be cleaned well during use, and heating is inconvenient, which brings certain adverse effects to people's use process. For this reason, we propose a robot sweeping mop ultrasonic bonding cutting device

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