Small mobile portable load resistor
A load resistance, portable technology, applied in the direction of resistors, resistor parts, resistor shells/packaging shells/potting, etc., can solve the problems of damage to wires and wires, skin melting and open circuit of small wires, achieve the effect of low temperature
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specific Embodiment
[0024] see Figure 1-Figure 5 , the specific embodiments of the present invention are as follows: a small mobile portable load resistor, its structure includes a joint 1, a fixed frame 2, a resistance block 3, the top surface of the joint 1 is welded to the bottom surface of the fixed frame 2, and the resistance block 3 The two ends are embedded and connected with the top of the fixed frame 2; the resistance block 3 includes a casing 31, a connection plate 32, a resistance column 33, and a heat expansion ring 34, and the connection plate 32 is embedded in the left side of the casing 31, and the resistance The left side of the column 33 is welded to the right side of the connecting plate 32. The heat expansion ring 34 is sleeved on the outer ring of the resistance column 33. There are three heat expansion rings 34, and the three heat expansion rings 34 are evenly sleeved on the The outer ring of the resistance column 33 is beneficial to enhance the heat dissipation effect.
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Embodiment 2
[0030] see Figure 6-Figure 7 The specific embodiment of the present invention is as follows: the expansion plate A25 includes an inner shaft B1, a threaded ring B2, a contact plate B3, a heat absorption groove B4, and a cooling block B5, and the inner ring of the threaded ring B2 is sleeved on the outer ring of the inner shaft B1 , the top surface of the contact plate B23 is embedded in the outer ring of the threaded ring B2, the heat-absorbing groove B4 and the outer layer of the contact plate B3 are integrated, the cooling block B5 is embedded in the inner layer of the contact plate B3, and the heat-absorbing groove B4 is integrally formed with the outer layer of the contact plate B3. There are multiple heat sinks B4, and the gaps between the multiple heat sinks B4 are evenly distributed on the outer layer of the contact plate B3, which is beneficial to increase the range of heat absorption.
[0031] Wherein, the cooling block B5 includes a connecting plate B51, a chuck B52...
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