Efficient, simple and convenient integrated circuit packaging device

An integrated circuit and packaging device technology, applied in the field of efficient and simple integrated circuit packaging devices, can solve the problems of time-consuming and laborious, low packaging efficiency, and complex positioning process of integrated circuit packaging.

Pending Publication Date: 2021-06-01
刘秀梅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an efficient and simple integrated circuit packaging device, which solves the complex positioning process of the existing integrated circuit packaging and requires the operator to manually position when packaging circuit boards of different sizes, and In the process of dispensing and packaging, it is necessary to manually adjust the position of the circuit board, which is time-consuming and laborious, and the packaging efficiency is low.

Method used

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  • Efficient, simple and convenient integrated circuit packaging device
  • Efficient, simple and convenient integrated circuit packaging device
  • Efficient, simple and convenient integrated circuit packaging device

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-8, the present invention provides a technical solution: an efficient and simple integrated circuit packaging device, including a base 1, the upper end of the base 1 is symmetrically fixed and connected to the front of the base 1 with a first box 3 through vertical columns, and the lower end surface of the inner cavity of the first box 3 The first shaft 2 is rotatably connected to the first pillar 4, the first disc 5 is fixedly connected to...

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Abstract

The invention discloses an efficient, simple and convenient integrated circuit packaging device, and relates to the technical field of circuit board packaging. The efficient, simple and convenient integrated circuit packaging device comprises a base, first box bodies are symmetrically and fixedly connected to the front portion of the upper end face of the base through vertical columns, a second sleeve is rotationally connected to one end of a second connecting rod, a second threaded rod is in threaded connection with the interior of the second sleeve, and second spring telescopic rods are fixedly connected to one end of the second threaded rod; a second driving plate is fixedly connected between the second spring telescopic rods, the lower portion of a second rotating shaft is in transmission connection with a second transmission shaft,a double-shaft driving motor is coaxially and fixedly connected with a second transmission shaft through an output shaft, and a placing table is fixedly connected to the position, between a first driving plate and a second driving plate, of the upper end face of the base through a supporting rod; according to the invention, automatic positioning can be carried out in the packaging process of the circuit board, the positioning process is simple and convenient, the angle of the circuit board during packaging and dispensing can be automatically adjusted, time and labor are saved, and the packaging efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board packaging, in particular to an efficient and simple integrated circuit packaging device. Background technique [0002] With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing in the direction of multi-function and miniaturization. In this way, the integration level of integrated circuits is required to be higher and higher, and the functions are more and more complex. Correspondingly, it is required that the packaging density of integrated circuits is increasing, the number of leads is increasing, the volume is getting smaller, the weight is getting lighter, and the replacement is getting faster and faster. The rationality and scientificity of the packaging structure will directly affect quality of integrated circuits. [0003] However, when the existing integrated cir...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/56
CPCH01L21/68H01L21/56
Inventor 刘秀梅
Owner 刘秀梅
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