Novel prepreg pressing and fixing method and lamination

A technology of prepreg and fixing method, which is applied in the direction of multi-layer circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of high processing cost, many operation processes, and slow production efficiency, so as to improve production efficiency, reduce production cost, and save The effect of consumable costs

Pending Publication Date: 2021-06-01
珠海市深联电路有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Through the above analysis, the problems and defects of the existing technology are: the existing method of using rivets to solve the problem of sliding b

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  • Novel prepreg pressing and fixing method and lamination
  • Novel prepreg pressing and fixing method and lamination
  • Novel prepreg pressing and fixing method and lamination

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] Aiming at the problems existing in the prior art, the present invention provides a novel prepreg pressing and fixing method. The present invention will be described in detail below with reference to the accompanying drawings.

[0031] Prepare a 10# stapler and staples 1 in advance, and stack and align multiple prepregs 2 of different thicknesses on the pre-lamination table. The pre-lamination table has a cross frame to quickly align prepregs 2 of different thicknesses. Flatten multiple prepregs 2, and use a stapler to reinforce the neat prepregs within 10 mm; reinforcement requirements: the long and short sides are g...

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Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and discloses a novel prepreg pressing and fixing method and a lamination. The method comprises the following steps of cutting prepregs corresponding to the size of a core board; fixing the prepregs by using a stapler according to the number of a laminated patterns in contrast with the pressed laminated patterns; overlapping the PP fixed in advance and the core board at the edge of the brownification line plate outlet for plate connection so that brownification plate connection and pre-lamination are realized; placing the overlapped plates in the steel plates of a bearing disc for typesetting; and sending the bearing disc into a hot press to be pressed. According to the novel prepreg pressing and fixing method, staples are used for fixing the prepregs in advance, the board connecting process and the pre-stacking process after brownification can be performed synchronously, the process of drilling the prepreg holes and core board rivet holes is omitted, the riveting process is shortened, the consumable cost is saved (the rivet cost is higher than the staples), the overall production efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and in particular relates to a novel prepreg pressing and fixing method and lamination. Background technique [0002] With the continuous development of the PCB industry, the market competition is fierce, and product profits are gradually decreasing, forcing PCB manufacturers to control production costs to increase product profits. In the prior art, the method of adding rivets is often used to solve the problem of sliding plates during the lamination process of the four-layer multi-prepreg structure, and the existing production process is cumbersome. [0003] The specific process is as follows: Drilling rivet holes on the core board → browning the board → cutting the prepreg → drilling rivet holes on the prepreg → riveting → pre-stacking → arranging boards → pressing, the existing production structure diagram is as follows Figure 5 shown. Therefore, this method has s...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/068
Inventor 杨勇常玉兵周建军王运玖吴传亮
Owner 珠海市深联电路有限公司
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