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A cooling method for electronic equipment

A technology of electronic equipment and heat dissipation method, which is applied in the construction of components of electrical equipment, cleaning methods using gas flow, cleaning methods and appliances, etc., which can solve the problems affecting the operation of equipment, the single function of heat dissipation devices, and the inability to achieve all-round heat dissipation, etc. problems, to achieve the effect of preventing poor heat dissipation

Active Publication Date: 2022-04-22
东莞昊骏信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electronic equipment refers to the equipment with certain functions composed of various electronic components. They are closely related to people's life. Electronic equipment can be seen everywhere from large to small. Small openings for heat dissipation, but it is still unavoidable to generate dust inside, which affects the heat dissipation of the equipment, and even affects the operation of the equipment. Therefore, electronic equipment with high heat dissipation requirements is equipped with additional heat dissipation devices in addition to the heat sink, but Existing heat dissipation devices have relatively single functions and cannot achieve all-round heat dissipation. Therefore, the heat dissipation methods of existing electronic equipment are difficult to meet the high heat dissipation requirements of electronic equipment.

Method used

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  • A cooling method for electronic equipment
  • A cooling method for electronic equipment
  • A cooling method for electronic equipment

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Embodiment Construction

[0022] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0023] like Figure 1 to Figure 5 As shown, the heat dissipation device of the electronic equipment according to the embodiment of the present invention includes a power box 11 arranged on the left side of the circuit box 12 of the electronic equipment. The supporting plate 19 of the power box 11, the power box 11 is provided with a moving cavity 13, the front and rear walls of the moving cavity 13 are slidingly connected with the moving plate 16, the left wall of the line cavity 18 is connected with a communication cavity 67 with an opening to the left, and the line cavity The left wall of 18 communicates with a placement cavity 61 with an opening to the left and located on the upper side of the communication cavity 67. The front and rear walls...

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Abstract

The invention discloses a heat dissipation method for electronic equipment, which comprises the following steps: when the temperature in the circuit cavity of the electronic equipment is too high, the moving motor starts to drive the detection blocks on the upper and lower sides to move rightward into the circuit cavity, and the rope motor drives the The winding wheel shaft rotates to drive the winding wheel to rotate, so that the articulated rod and the widening block can push the line after contacting the line in the line cavity and push the line up to collect. By continuing to move the moving plate, the fan box is pushed to the side by the push block. Move right into the circuit cavity, at this time, when the push rod is in contact with the structure or the circuit inside the circuit cavity and cannot move to the right, the push rod moves to the left and overcomes the thrust of the induction spring to press the induction button, and the movement is closed at this time The motor stops the moving plate and continues to move. At the same time, the gear motor starts to make the forward fan and the side fans on the upper and lower sides rotate, taking away the heat and also sucking the dust in the circuit cavity in all directions. At this time, the dust in the circuit cavity Dust can enter the dust removal holes on the upper and lower sides and be discharged outwards to prevent poor heat dissipation caused by dust accumulation inside.

Description

technical field [0001] The invention relates to the field of electronic communication, in particular to a heat dissipation method for electronic equipment. Background technique [0002] Electronic equipment refers to the equipment with certain functions composed of various electronic components. They are closely related to people's life. Electronic equipment can be seen everywhere from large to small. Small openings for heat dissipation, but it is still unavoidable to generate dust inside, which affects the heat dissipation of the equipment, and even affects the operation of the equipment. Therefore, electronic equipment with high heat dissipation requirements is equipped with additional heat dissipation devices in addition to the heat sink, but Existing heat dissipation devices have relatively single functions and cannot achieve all-round heat dissipation. Therefore, existing heat dissipation methods for electronic equipment cannot meet the high heat dissipation requirement...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20B08B5/04
CPCH05K7/20136H05K7/20209B08B5/04
Inventor 金扬芳李霞
Owner 东莞昊骏信息技术有限公司
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