Detonating device circuit board encapsulating method and vacuum system

A technology of detonation device and vacuum system, which is applied to the device for coating liquid on the surface, pretreatment surface, coating and other directions, can solve the problem that large-scale automatic vacuum potting equipment cannot be used, and achieve the effect of fast potting

Inactive Publication Date: 2021-06-04
SHANXI FENXI HEAVY IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the embodiment of the present invention, a circuit board potting method and a vacuum system of the detonating device are provided to solve the problem in the prior art that large-scale automatic vacuum potting equipment cannot be used for potting a small number of circuit boards

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  • Detonating device circuit board encapsulating method and vacuum system
  • Detonating device circuit board encapsulating method and vacuum system
  • Detonating device circuit board encapsulating method and vacuum system

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Embodiment Construction

[0042] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0043] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates otherwise, "multiple" Generally contain at least two.

[0044] It sho...

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Abstract

The invention discloses a detonating device circuit board encapsulating method and vacuum system. The method comprises the following steps that component A silica gel and component B silica gel with the same weight are uniformly mixed and stirred to obtain a mixed gel solution; vacuum defoaming is carried out on the mixed glue solution through the vacuum system; the defoamed mixed gel solution is used for conducting encapsulating on a detonating device circuit board; and medium-high temperature curing molding is performed on the encapsulated circuit board. According to the method and system, the problem that large-scale automatic vacuum encapsulation equipment cannot be adopted for encapsulation of a small number of circuit boards in the prior art is solved so that the small number of the circuit boards can be conveniently and quickly encapsulated.

Description

technical field [0001] The invention relates to the technical field of circuit board potting, in particular to a circuit board potting method and a vacuum system for an explosion device. Background technique [0002] At present, for the encapsulation of a large number of circuit boards, most of them use polyurethane rubber for encapsulation through large-scale automatic vacuum encapsulation equipment. The production quantity of the upper body parts is small in each batch, so the amount of potting required is small. When the potting quantity of the upper body parts of the detonating device circuit board is less than 300 sets, it is impossible to use large-scale automatic vacuum potting equipment for potting , manual potting is required. [0003] Aiming at the problem that large-scale automatic vacuum potting equipment cannot be used for potting a small number of circuit boards in the prior art, no effective solution has been proposed yet. Contents of the invention [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/26B05D3/02B05C11/10
CPCB05D1/26B05D3/0254B05C11/10
Inventor 梁龙云李健齐文忠李凤高志明范少龙王晓庆李伟张慧马波义
Owner SHANXI FENXI HEAVY IND
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