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Laser drilling machine for glass product processing

A technology for laser drilling machines and glass products, which can be used in manufacturing tools, laser welding equipment, metal processing equipment, etc., and can solve problems such as landing and low efficiency.

Inactive Publication Date: 2021-06-04
龚婉婷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a laser drilling machine for processing glass products, to solve the problem that in the prior art proposed in the above background technology, the excess glass in some through holes will fall in the through holes, and manual knocking is required in the later stage. Only then can it be taken out, this method is inefficient and needs to be improved

Method used

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  • Laser drilling machine for glass product processing
  • Laser drilling machine for glass product processing
  • Laser drilling machine for glass product processing

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] see Figure 1-10, the present invention provides a technical solution: a laser drilling machine for processing glass products, including a fixed frame 1, a placing plate 13 is symmetrically installed in the middle of the top of the fixing frame 1, and the sides of the two placing plates 13 that are far away from each other are both Movable boards 4 are provided, and the two movable boards 4 are slidingly fitted with the two placement boards 13. The bott...

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Abstract

The invention discloses a laser drilling machine for glass product processing. The laser drilling machine comprises a fixing frame, wherein placing plates are symmetrically arranged in the middle of the top of the fixing frame, movable plates are arranged on the sides, away from each other, of the two placing plates, the two movable plates are in sliding fit with the two placing plates, lifting mechanisms are arranged at the bottoms of the two movable plates, vibration mechanisms are arranged above the two movable plates, each vibration mechanism comprises a transverse plate arranged above one movable plate, reset mechanisms are arranged at the two ends of the transverse plate, a plurality of sets of knocking blocks are arranged on the surface, close to the movable plates, of the transverse plate at equal intervals in the horizontal direction, the surface, away from the knocking blocks, of the transverse plate is movably attached to a pressing seat, a guide rod is inserted into the top of the pressing seat, and an L-shaped seat is arranged on the outer side of the guide rod. According to the laser drilling machine, drilling is facilitated, meanwhile, the operation mode of manual knocking in the later period is changed, and the working efficiency of drilling forming is improved.

Description

technical field [0001] The invention relates to the technical field of laser drilling, in particular to a laser drilling machine for processing glass products. Background technique [0002] Laser drilling machine is the earliest practical laser processing technology, and it is also one of the main application fields of laser processing. Laser drilling machine is mainly used between the inner layer and the inner layer, the outer layer and the inner layer of the printed circuit board. The connection of the copper plate and the inner layer of resin is pierced with a high-precision laser, and then the line connection is completed after copper plating. Compared with other drilling equipment, the laser drilling machine is, for example, processing micron on the high melting point metal molybdenum plate. Apertures of several tens of microns are processed on hard tungsten carbide; deep holes of tens of microns are processed on red and sapphire, as well as diamond wire drawing dies, s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/382B23K26/70
CPCB23K26/36B23K26/382B23K26/702B23K2103/54
Inventor 龚婉婷
Owner 龚婉婷
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