Connecting structure of probe card holder

Abstract

The invention belongs to the technical field of probe cards, and particularly relates to a connecting structure of a probe card holder, which comprises a probe card board and a card board connecting structure, wherein a probe card is arranged on the probe card board, the probe card board is connected with a detection circuit through the card board connecting structure, and as the connecting structure is arranged at the lower end of a lifting platform, when the lifting platform descends to the bottom, the lifting platform is in lap joint with the plug supporting plate, the plug supporting plate moves downwards, and the plug sliding block drives the connecting plug to slide inwards relative to the plug supporting plate under the guiding action of the vertical frame sliding groove until the front end of the connecting plug is inserted into the socket in the side face of the probe clamping plate. Thus, when the lifting platform descends to the bottom, the connecting plug can be automatically connected with the probe card board, and when the lifting platform leaves the bottom, the connecting plug can be automatically disconnected from the probe card board.

Description

technical field [0001] The invention belongs to the technical field of probe cards, in particular to a connection structure of a probe card holder. Background technique [0002] With the development of the semiconductor industry, more and more electronic devices are connected to the semiconductor wafer. During the manufacturing process of the semiconductor device, the probe is contacted with the metal end on the semiconductor wafer to realize a temporary electrical connection. The electrical signal of the tester is transmitted to the semiconductor device through the probe, and the tester detects the electronic device on the semiconductor wafer through the returned electrical signal. [0003] The probe card is the link between the semiconductor wafer and the tester. By integrating multiple probes on the probe card, multiple probes can be simultaneously contacted with multiple semiconductor devices on the semiconductor wafer to improve detection efficiency. . [0004] In the...

AI Technical Summary

Problems solved by technology

[0004] In the production process of semiconductor devices, it is necessary to visit a large number of circuit contacts in one or more devices multiple times, and move the probe card through the moving mechanism to make the probes contact with the contacts. At the same time, to match the detection process For multiple sets of contacts in the probe card, multiple probe cards need to be set, and the probe card is fixed by the holder. The holder is a polyhedron that can rotate. By setting one or more probe cards on each surface, the When switching the probe card, by rotating the holder, the corresponding probe card is rotated to the top of the semiconductor device for detection, or multiple movable platforms are set up to move the probe card to realize the connection between the probe card and different contact groups. Matching, in the prior art, in order to realize the detection of multiple sets of contacts, the exchange of probe cards is used to achieve matching, and the matching is achieved by switching different probe cards. The existing holder adopts polyhedron and mobile Due to the platform structure, multiple probe cards cannot be set, and the number of switchable probe cards is limited

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