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Semiconductor circuit, particularly for use in integrated module

A semiconductor and circuit technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of short circuit between the control wire and the shield wire of the semiconductor chip, etc.

Inactive Publication Date: 2003-12-03
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inspection of semiconductor chips by means of electron radiation detectors or ion milling cutters leads to short-circuiting of the control and shielding lines, whereby access to the memory via I / O pins is no longer possible

Method used

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  • Semiconductor circuit, particularly for use in integrated module
  • Semiconductor circuit, particularly for use in integrated module
  • Semiconductor circuit, particularly for use in integrated module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] figure 1 A cross-sectional view of a semiconductor circuit of the present invention is shown.

[0029] The semiconductor circuit contains a drive component (not shown in this direction) and an initialization component (not shown in this direction), which are connected to each other via a connecting line approximately 1 μm wide. The connecting wire 1 is separated at the separation position A-B after the semiconductor circuit is mounted. A first potential line 2 and a second potential line 3 are also contained within the area of ​​the connecting line 1 and at a distance of approximately 1 μm. A defined potential is present on potential line 2 and potential line 3 , which can be detected both by the drive component and by the initialization component.

[0030] figure 2 show figure 1 Details of the semiconductor circuit at the separation position A-B in the cross-sectional direction in .

[0031] In this view it can be seen particularly clearly that the connecting lin...

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PUM

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Abstract

A semiconductor circuit, in particular for use in an integrated module, has at least one operational assembly with a drive circuit, such as a microprocessor, and a data memory. The semiconductor circuit has at least one initialization assembly for testing and / or for initializing the operational assembly. A disconnectable connecting line connects the operational assembly to the initialization assembly. In order to increase reliability, the initialization assembly is permanently disconnected from the operational assembly, by disconnecting the connecting lines, after the semiconductor circuit has been completed. In order to make it more difficult to reactivate the disconnected connecting lines, the semiconductor circuit has a potential line connected to the initialization assembly and / or to the operational assembly in a region of the connecting line. The initialization assembly and / or the operational assembly are configured in such a way that, when the potential line is connected to the connecting line, the initialization assembly is placed in an inactive state.

Description

technical field [0001] The present invention relates to a semiconductor circuit, especially a semiconductor circuit used in an integrated module, which has the following characteristics: [0002] - at least one drive assembly with a control circuit such as a microprocessor and with a data memory; [0003] - at least one initialization component for detecting and / or initializing a drive component or drive components; [0004] - At least one drive component is connected to at least one initialization component via at least one separate connection line. Background technique [0005] In the semiconductor circuits mentioned above, this memory is often used as a non-volatile programmable data memory. During the production of a semiconductor circuit, data are written into the data memory, for example by means of an initialization module. It is also possible for the drive component to be switched to a state by means of the initialization component, wherein this state can be detec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/822G06F1/00G06F12/14G06F21/87H01L23/525H01L23/544H01L23/58H01L27/04
CPCH01L2924/0002H01L23/585H01L23/544H01L23/525G06F2221/2143H01L23/576G06F21/87H01L2924/00G06F1/00
Inventor A·策尔纳A·雷施迈尔W·波克兰德特
Owner SIEMENS AG