Manufacturing method of packaged antenna, packaged antenna and electronic equipment
A manufacturing method and technology of electronic equipment, applied to antenna supports/mounting devices, antennas, antenna parts, etc., can solve the problems of easy tilting of column structures, poor stability, and poor process precision, etc.
Active Publication Date: 2021-07-06
长沙新雷半导体科技有限公司
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Problems solved by technology
[0005] The object of the present invention is to provide a method for manufacturing a packaged antenna, a packaged antenna and electronic equipment, so as to solve the problems of easy tilting of the column structure in the existing packaged antenna, poor stability and poor process precision
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[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0032] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...
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The invention discloses a manufacturing method of a packaged antenna, the packaged antenna and electronic equipment, the manufacturing method of the packaged antenna comprises the following steps: an electronic element and a connecting column structure are fixedly arranged on a substrate, the connecting column structure comprises a connecting plate and a plurality of columns, the plurality of columns are arranged on the connecting plate at intervals, the plurality of columns are fixedly arranged on the substrate, the connecting plate and the base plate are arranged in parallel separately, and the connecting plate is located over the base plate; the connecting column structure, the electronic element and the substrate are subjected to plastic packaging through plastic, and the connecting column structure, the electronic element and the substrate are all wrapped with the plastic; and the connecting plate and the plastic are gradually ground from top to bottom until the connecting plate is completely removed. Due to the fact that the multiple stand columns are fixedly arranged on the same connecting plate, when the stand columns need to be welded to the base plate, the stand columns can be erected on the base plate firstly, the stand columns can be stably erected on the base plate, then welding is conducted, it can be guaranteed that the stand columns are kept stable and upright when welded to the base plate, and the stand columns can be prevented from inclining or collapsing in the plastic packaging process.
Description
technical field [0001] The invention relates to the technical field of antennas, in particular to a method for manufacturing a packaged antenna, a packaged antenna and electronic equipment. Background technique [0002] Due to the advancement of technology, various high-tech electronic products have been developed to facilitate people's lives, including various electronic devices, such as notebook computers, mobile phones, and tablet computers. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasing the fle...
Claims
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Login to View More IPC IPC(8): H01Q1/36H01Q1/22H01Q1/24H05K3/34
CPCH01Q1/36H01Q1/2266H01Q1/243H05K3/34
Inventor 张凤霞
Owner 长沙新雷半导体科技有限公司