Method for improving trepanning alignment and multi-layer PCB

Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a method for improving trepanning alignment and a multi-layer PCB, and the method for improving trepanning alignment comprises the following steps: S1, arranging a through hole alignment target on each layer of PCB, arranging the through hole alignment targets on each layer of PCB oppositely in the vertical direction, determining the layer of the PCB corresponding to the hole bottom of the blind hole and the layer of the PCB through which the blind hole passes, and arranging blind hole alignment targets on the PCB corresponding to the hole bottom of the blind hole and the PCB through which the blind hole passes, wherein the blind hole alignment targets on each layer of PCB are oppositely in the vertical direction, and the blind hole alignment targets are not arranged on other PCBs without blind holes; S2, laminating a plurality of layers of PCBs to form a mother board; and S3, processing a through hole in the mother board according to the through hole alignment target, and processing a blind hole in the mother board according to the blind hole alignment target. According to the invention, the precision of forming the blind holes and the through holes in the multi-layer PCB can be improved.

Description

technical field [0001] The invention relates to the technical field of PCB board production, in particular to a method for improving hole alignment and a multilayer PCB board. Background technique [0002] With the development of electronic technology, PCB boards are widely used in production and life. Among them, the conventional multi-layer PCB board aligns the through holes, and adopts the method of taking the center of the target position of each layer of the PCB board. This method can determine a more suitable through hole when there is a size and position deviation between the layers of the multi-layer board. position, but when using a laser machine to open a blind hole on a multi-layer PCB board, it only needs to laser to the layer of the PCB board corresponding to the bottom of the blind hole. , The target position of the PCB board without blind holes will affect the opening accuracy of the blind holes, resulting in deviations in the opened blind holes, which cannot...

AI Technical Summary

Problems solved by technology

Among them, the conventional multi-layer PCB board aligns the through holes, and adopts the method of taking the center of the target position of each layer of the PCB board. This method can determine a more suitable through hole when there is a size and position deviation between the layers of the multi-layer board. position, but when using a laser machine to open a blind hole on a multi-layer PCB board, it only needs to laser to the layer of the PCB board corresponding to the bottom of the blind hole. , the target position of the PCB without blind holes will affect the opening accuracy of the blind holes, resulting in deviations in the opened blind holes, which cannot meet the requirements

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