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Resistance test structure and method

A test structure and resistance test technology, applied in the direction of measuring resistance/reactance/impedance, measuring device, measuring electrical variables, etc., can solve the problem of large error of through-hole resistance, and achieve the effect of improving accuracy

Inactive Publication Date: 2021-07-16
海安集成电路技术创新中心 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The through-hole resistance obtained by this scheme includes the resistance of the interconnection part, and the error of the obtained through-hole resistance is large

Method used

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  • Resistance test structure and method
  • Resistance test structure and method
  • Resistance test structure and method

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Experimental program
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Embodiment Construction

[0013] In view of the problems mentioned in the background technology, the embodiment of the present invention proposes the following through-hole test structure and corresponding calculation method to eliminate the influence of the resistance of the interconnection part on the through-hole resistance in the existing test structure, and improve the efficiency of testing the through-hole resistance. Accuracy.

[0014] Fig. 1 is a schematic diagram of the test structure in the embodiment of the present invention. The structure and method for testing the via resistance proposed in the embodiment of the present invention include:

[0015] The structure comprises a plurality of sub-test structures 10, 20, 30;

[0016] The sub-test structure 10 includes interconnection parts 111, 112, and a through hole unit 12, and in the structure, the interconnection lines 111 and 112 are connected through the through hole in the through hole unit 12, and the interconnection line 111 and the thro...

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Abstract

The invention provides a through hole resistance test structure and method so as to improve the test accuracy of through hole resistance. The test structure comprises at least two sub-test structures, each sub-test structure is a through hole chain and comprises a plurality of through hole units and interconnection lines connected with the through hole units, every two adjacent through hole units are connected through the corresponding interconnection line, the number of through holes contained in the through hole units in the same sub-test structure is the same, the interconnection lines are composed of interconnection lines respectively located on two adjacent metal layers, the interconnection lines on the upper layer and the lower layer have an overlapping area at the through hole connecting position, the number of through holes of the sub-test structures in the through hole units is different from each other, and the interconnection lines of the sub-test structures are completely the same.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a through-hole resistance measurement structure and method. Background technique [0002] With the development of technology, the level of integration is getting higher and higher, more and more transistors are included in the integrated circuit, and the number of interconnection layers has also increased from the previous three or four layers to nine or even ten layers. The number of contact holes connecting these transistors and interconnects together, as well as vias connecting interconnects on different metal layers together, has increased dramatically. [0003] With the development of integrated circuits, the electrical parameters such as the parasitic resistance and capacitance of the back-end interconnection lines have become important factors in determining the performance of the circuit, so the through holes connecting these interconnection lines are becoming more and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/02
CPCG01R27/02
Inventor 蒋乐乐陆宇马松沈立
Owner 海安集成电路技术创新中心