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A heat sink, circuit board assembly and electronic equipment

A technology of circuit board assembly and heat dissipation device, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., and can solve problems such as low heat dissipation efficiency of radiators, large thermal resistance, and overtemperature of devices

Active Publication Date: 2022-07-22
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned heat dissipation scheme, some components to be dissipated may be relatively far away from the radiator, for example, the components to be dissipated are relatively far away from the radiator, so the thermal resistance when transferring heat to the radiator through the air is relatively small. Large, it is easy to form a high temperature zone locally near the small size device, causing the device to overheat, resulting in low heat dissipation efficiency of the radiator

Method used

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  • A heat sink, circuit board assembly and electronic equipment
  • A heat sink, circuit board assembly and electronic equipment
  • A heat sink, circuit board assembly and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] refer to figure 2 , the heat dissipation device 100 provided by the embodiment of the present application is suitable for the circuit board 10 , and the circuit board 10 may be provided with a plurality of heating elements 20 .

[0105] The circuit boards are divided according to the number of layers, and can be divided into single-panel, double-panel, and multi-panel. The situation is similar to this, and details are not repeated in this embodiment.

[0106]The heating element 20 refers to electronic components arranged on the circuit board, such as output inductors, capacitors, etc. The heating elements on the circuit board 10 have different sizes and specifications according to different types. The element 20 includes a heating element 21 having a larger size (eg, relatively close to the substrate) and a heating element 22 having a smaller size (eg, relatively far from the substrate) for illustration. refer to figure 2 , the heating element 21 and the heating el...

Embodiment 2

[0156] This embodiment provides a circuit board assembly, refer to Figure 13 The circuit board assembly 200 includes a circuit board 10 provided with a plurality of heating elements 20 and the above-mentioned heat dissipation device 100 . The structure, function, working principle, etc. of the heat dissipation device 100 have been introduced in detail in the first embodiment, and will not be repeated here.

[0157] In the embodiment of the present application, a plurality of heating elements 20 may be provided on the circuit board 10. In order to dissipate heat from the heating elements 20, the heat dissipation device 100 may include a substrate 30, and the heating elements 20 are provided between the substrate 30 and the circuit board 10. And, in order to quickly transfer the heat on the heating element to the substrate 30, at least one thermal conductor 50 can be provided on the side of the substrate 30 facing the circuit board 10, one end of the thermal conductor 50 is con...

Embodiment 3

[0167] The embodiment of the present application provides an electronic device, refer to Figure 16 , the electronic device 300 includes a casing 301 and the above-mentioned circuit board assembly 200 , and the circuit board assembly 200 is arranged inside the casing 301 .

[0168] The structure, function, working principle, etc. of the heat dissipation device and the circuit board assembly have been introduced in detail in the first embodiment and the second embodiment, and will not be repeated here.

[0169] In the embodiment of the present application, a plurality of heating elements 20 may be provided on the circuit board 10 of the electronic device. In order to dissipate heat from the heating elements 20, the heat dissipation device 100 may include a substrate 30, and the substrate 30 and the circuit board 10 are provided with One side of the heating element 20 is oppositely arranged; and, in order to quickly transfer the heat on the heating element 20 to the substrate 30...

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Abstract

Embodiments of the present application provide a heat dissipation device, a circuit board assembly, and an electronic device. The heat dissipation device is suitable for a circuit board. There are multiple heating elements on the circuit board. The heat dissipation device includes a substrate. The side of the substrate facing the circuit board is provided with at least one thermal conductor. One end of the thermal conductor is connected to the substrate, and the other end extends toward the circuit board and is close to heating element. The side of the substrate facing the circuit board is provided with at least one thermal conductor, one end of the thermal conductor is connected to the substrate, and the other end of the thermal conductor extends toward the circuit board and is close to the heating element. The heat generated by each heating element can pass through the thermal resistance. The smaller thermal conductor is quickly transferred to the substrate, and then dissipated from the substrate to the external environment, which effectively reduces the heat transfer resistance from the heating element to the substrate and improves the heat dissipation efficiency of the heat dissipation device.

Description

technical field [0001] The present application relates to the field of heat dissipation technology, and in particular, to a heat dissipation device, a circuit board assembly and an electronic device. Background technique [0002] With the advent of the era of high-speed communication, the energy consumption of electronic equipment, such as communication base stations, continues to rise. Distributed Processing Unit (DPU) is one of the main power supply products for base stations in the future. With the increase in its power requirements, the corresponding The heat of the ground device is also serious. If the heat cannot be discharged in time, it will seriously affect the normal operation and service life of the device. [0003] At present, the components to be radiated in the distributed power supply unit are generally dissipated by a radiator. For example, refer to figure 1 As shown, a plurality of components to be radiated 85 are mounted on the circuit board 81, the upper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/205H05K7/20509H05K7/20454
Inventor 韦隆和陈君廉志晟李泉明
Owner HUAWEI DIGITAL POWER TECH CO LTD