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Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly

A technology of thermocompression bonding and bonding head, which can be used in electric heating devices, metallurgical bonding, electric solid devices, etc., and can solve the problem of time-consuming removal.

Pending Publication Date: 2021-07-20
KULICKE & SOFFA IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The process of removing this material is time consuming due to the need for a separate fluxing process and the time it takes to remove the material (e.g., dissolve, burn out, etc.)

Method used

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  • Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
  • Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
  • Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly

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Embodiment Construction

[0038] As used herein, the term "semiconductor element" means any structure that contains (or is constructed to contain in a subsequent step) a semiconductor chip or die. Exemplary semiconductor components include bare semiconductor dies, semiconductor dies on substrates (e.g., lead frames, PCBs, carriers, semiconductor chips, semiconductor wafers, BGA substrates, semiconductor components, etc.), packaged semiconductor devices, flip-chip Semiconductor devices, dies embedded in substrates, stacks of semiconductor dies, interposers (eg, glass or silicon substrates with fine pitch circuitry), and the like.

[0039] As used herein, the terms "substrate" and "workpiece" mean any structure to which a semiconductor element can be bonded (eg, thermocompression bonded, etc.). Illustrative substrates include, for example, lead frames, PCBs, carriers, semiconductor chips, semiconductor wafers, BGA substrates, semiconductor components, interposers (eg, glass or silicon substrates with fin...

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Abstract

A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.

Description

[0001] This application is a divisional application of Chinese Invention Patent Application No. 201510385809.5 filed on June 30, 2015, entitled "Thermocompression bonder, its operation method, and interconnection method of fine-pitch flip-chip components" . [0002] related application [0003] This application claims priority to US Provisional Patent Application No. 62 / 019,053, filed June 30, 2014, the contents of which are incorporated herein by reference. technical field [0004] The present invention relates to the formation of electrical interconnections in semiconductor packages, and more particularly to an improved thermocompression bonding system and method of operation thereof. Background technique [0005] During the processing and packaging of semiconductor devices, flip-chip and thermocompression bonding techniques are used in the interconnection of specific devices. Associated with this technique, a first substrate (eg, a die) is bonded to a second substrate (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768
CPCH01L21/76895H01L24/76H01L24/82H01L2224/76301H05K3/3489H05K3/3494H05K2201/10674H01L24/75H01L24/81H01L2224/13082H01L2224/16238H01L2224/75251H01L2224/75252H01L2224/81024H01L2224/81191H01L2224/81203H01L2224/81204H01L2224/81048H01L2224/75161H01L2224/75184H01L2224/131H01L2224/13147B23K1/0016B23K1/203B23K3/04B23K3/082B23K2101/42H01L2924/014H05K3/34H05K2203/04
Inventor G·弗里克T·J·小科洛西莫H·克劳贝格
Owner KULICKE & SOFFA IND INC
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