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Automatic grinding and preparation device and method for conductive silver adhesive for LED production

A conductive silver glue and configuration device technology, which is applied in the field of automatic grinding and configuration devices for conductive silver glue used in LED production, can solve problems such as easy generation of air bubbles and inconvenient configuration of conductive silver glue

Inactive Publication Date: 2021-07-30
黄树赞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide an automatic grinding and disposing device for conductive silver glue for LED production with small error, easy operation and automatic defoaming for the above-mentioned problems of inconvenient configuration of conductive silver glue and easy generation of bubbles

Method used

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  • Automatic grinding and preparation device and method for conductive silver adhesive for LED production
  • Automatic grinding and preparation device and method for conductive silver adhesive for LED production
  • Automatic grinding and preparation device and method for conductive silver adhesive for LED production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as Figure 1-3 As shown, a conductive silver glue automatic grinding configuration device and method for LED production includes a configuration box 1, and a sieve plate 2 is slidably connected to the inner wall of the configuration box 1. It should be noted that the sieve plate 2 is a porous sieve A limit plate 14 is fixedly connected to the inner wall of the configuration box 1. The lower end of the limit plate 14 is fixedly connected to the sieve plate 2 through a vibrating spring 15. The lower end of the sieve plate 2 is provided with a foam breaking mechanism 3. It should be noted that The foam breaking mechanism 3 includes a plurality of foam breaking needles 16 fixedly connected to the lower surface of the sieve plate 2 , and the plurality of foam breaking needles 16 are arranged on the lower surface of the sieve plate 2 in an annular array.

[0029] In this embodiment, an annular support plate 4 is fixedly connected to the inner side wall of the configurati...

Embodiment 2

[0037] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that the lower end of the lifting plate 11 is rotatably connected with a rotating rod 21, and the lower end of the rotating rod 21 runs through the annular support plate 4 and the sieve plate 2 in sequence and is fixedly connected with a stirring impeller 23. , the annular support plate 4 is fixedly embedded with a threaded cylinder 22, the rotating rod 21 is provided with threads, the threaded cylinder 22 is sleeved outside the rotating rod 21 and is threadedly connected with the rotating rod 21, and the rotating rod 21 is slidably connected with the sieve plate 2.

[0038] In this embodiment, when the heat-shrinkable memory spring 12 stretches, it drives the lifting plate 11 to move upwards, and then drives the rotating rod 21 to move upwards. Since the threaded cylinder 22 cannot rotate, the rotating rod 21 drives the stirring impeller 23 to rotate. The resin matrix is ​​stirred to...

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Abstract

The invention belongs to the field of LED production equipment, and particularly relates to an automatic grinding and preparation device and method for conductive silver adhesive for LED production. The automatic grinding and preparation device comprises a preparation box body, wherein a sieve plate is slidably connected to the inner side wall of the preparation box body; a foam breaking mechanism is arranged at the lower end of the sieve plate; an annular supporting plate is fixedly connected to the inner side wall of the preparation box body; a grinding groove is fixedly connected to the inner ring side wall of the annular supporting plate; the grinding groove and the sieve plate are made of magnetic materials and are attracted by each other in a heteropolar manner; a plurality of grinding holes penetrating through the grinding groove are formed in the grinding groove; a grinding ball is arranged above the grinding groove; a storage cavity is formed in the grinding ball; and the grinding ball is matched with the grinding groove. According to the automatic grinding and preparation device and method, silver powder can be ground by the grinding ball and the grinding groove, the position of the grinding ball is adjusted through the temperature generated during grinding to realize automatic addition of the silver powder, and the sieve plate is driven to move for defoaming operation, so that rapid preparation of the conductive silver adhesive is facilitated.

Description

[0001] This application is a divisional application with an application date of December 3, 2019 and an application number of CN 201911217805.0, whose invention name is a conductive silver glue automatic grinding and configuration device for LED production. technical field [0002] The invention belongs to the field of LED production equipment, and in particular relates to a conductive silver glue automatic grinding configuration device and method for LED production. Background technique [0003] The conductive silver glue combines the conductive particles together through the bonding effect of the matrix resin to form a conductive path and realize the conductive connection of the adhered materials. The conductive silver glue has been widely used in liquid crystal displays (LCDs), light-emitting diodes (LEDs), integrated The packaging and bonding of electronic components and components such as circuit (IC) chips, printed circuit board assemblies (PCBA), dot matrix blocks, cer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C15/00B02C23/16B02C23/00
CPCB02C15/00B02C23/00B02C23/16B02C2023/165
Inventor 黄树赞
Owner 黄树赞
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