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Self-dressing grinding wheel for semiconductor material machining as well as preparation method and application of self-dressing grinding wheel

A material processing and self-dressing technology, which is applied in metal processing equipment, bonded grinding wheels, abrasives, etc., can solve the problems of low grinding stability, difficulty in synchronous sintering, and difficulty in realization, achieving high preparation efficiency and easy industrial production , the effect of simple preparation method

Active Publication Date: 2021-11-12
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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Problems solved by technology

[0005] Aiming at the technical problems of low grinding stability, poor service life and difficulty in improving the sharpness of the existing semiconductor grinding wheel, the present invention proposes a self-dressing grinding wheel for semiconductor material processing and its preparation method and application. First, through A metal-based fan-shaped abrasive layer is set on the grinding wheel base to ensure the grinding strength of the grinding wheel and play the role of grinding and support; secondly, a through hole is set on the metal-based fan-shaped abrasive layer, and the through hole is filled with a composite material solidification layer. Lower than the metal-based fan-shaped abrasive layer, it falls off from the through hole and spreads to the grinding surface during the grinding process, which acts like a grinding paste. It can not only repair the metal-based fan-shaped abrasive layer, but also keep it sharp state, it also plays an auxiliary grinding role on the workpiece, and can improve the processing quality of the workpiece surface; thirdly, under the interaction of the two structural layers, the grinding wheel can always maintain self-sharpening during the processing of semiconductor materials , without the need for a third-party dressing tool, greatly improving the stability of the workpiece processing quality. Finally, compared with the method of directly mixing metal, ceramics, and resin as a binder to improve the sharpness of the grinding wheel, the preparation method of the present invention avoids the need for metals, ceramics, etc. , There is a large difference in melting point between resin binders, it is difficult to sinter synchronously and the density difference is large, and the mixing is difficult to mix. The preparation method is simple, the preparation efficiency is high, and it is easy for industrial production

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  • Self-dressing grinding wheel for semiconductor material machining as well as preparation method and application of self-dressing grinding wheel
  • Self-dressing grinding wheel for semiconductor material machining as well as preparation method and application of self-dressing grinding wheel
  • Self-dressing grinding wheel for semiconductor material machining as well as preparation method and application of self-dressing grinding wheel

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Embodiment 1

[0036] Embodiment 1, a kind of self-dressing grinding wheel for semiconductor material processing, such as figure 1As shown, it includes a grinding wheel matrix 1 and an abrasive layer. The abrasive layer includes a metal matrix bond sector 2 and a composite material layer 3. The metal matrix bond sector 2 is annularly arranged on the grinding wheel matrix 1, and the composite material layer 3 is arranged on the metal matrix. In the through hole 4 on the sector block 2 of the bonding agent. When using the self-dressing grinding wheel for semiconductor material processing, firstly, the metal-based bond segment 2 ensures the grinding strength of the grinding wheel, and plays the role of grinding and support; The hole 4 is filled with a composite material layer 3. The strength of the composite material layer 3 is lower than that of the metal-based binder sector 2. During the grinding process, it falls off from the through hole 4 and spreads to the grinding surface, which acts lik...

Embodiment 2

[0051] Embodiment 2, a kind of preparation method of the above-mentioned semiconductor material processing self-dressing grinding wheel of this embodiment, such as image 3 shown, including the following steps:

[0052] S1. Put tin powder, titanium powder, ferric oxide, organic pore-forming agent, diamond and copper powder into a mixer and mix them evenly to obtain a mixture. Specifically, the raw materials for the preparation of the metal-based binder sector 2 are selected. In this embodiment, the mass percentage of tin powder is 25%, the mass percentage of titanium powder is 10%, the mass percentage of ferroferric oxide is 5%, organic The mass percentage of pore-forming agent is 5%, the mass percentage of diamond is 5%, the mass percentage of copper powder is 50%, the median particle size of tin powder, titanium powder and ferric oxide is all ≤10μm, and the diamond particle size is 43~48μm, polystyrene microspheres (PS microspheres) are selected as the organic pore-forming ...

Embodiment 3

[0061] Embodiment 3, a method for preparing a self-dressing grinding wheel for processing semiconductor materials. The difference between this embodiment and Embodiment 2 is that in step S1 of this embodiment, the mass percentage of tin powder is 40%, and the mass percentage of titanium powder The percentage is 6%, the mass percentage of ferroferric oxide is 3%, the mass percentage of organic pore-forming agent is 2%, the mass percentage of diamond is 4%, the mass percentage of copper powder is 45%, and the diamond particle size is 5~ 10 μm, the organic pore-forming agent is polymethyl methacrylate (PMMA), the particle size of the organic pore-forming agent is 7-14 μm, and the total mixing time is 3 hours; in step S2, the sintering temperature is 520°C, and the sintering pressure is is 180MPa, the area of ​​the through hole 4 accounts for 40% of the total area of ​​the end face of the metal-based binder fan-shaped block 2; in step S4, CaSO 4 ·H 2The mass percentage of O powde...

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Abstract

The invention provides a self-dressing grinding wheel for semiconductor material machining as well as a preparation method and application of the self-dressing grinding wheel, and aims to solve the technical problems that an existing semiconductor grinding wheel is low in grinding stability and short in service life as well as the grinding wheel sharpness is difficult to improve. Through the metal-based fan-shaped grinding material layer, the grinding strength of the grinding wheel is guaranteed, and the grinding and supporting effects are achieved; through holes are filled with a composite material curing layer, the strength of the composite material curing layer is lower than that of the metal-based fan-shaped grinding material layer, and the composite material curing layer plays a role similar to grinding paste, so that not only can the effect of dressing the metal-based fan-shaped grinding material layer and always keeping the metal-based fan-shaped grinding material layer in a sharp sate be achieved, but also the auxiliary grinding effect on a workpiece can be achieved and the workpiece surface machining quality can be improved; under the interaction of the two structural layers, the self-sharpening effect of the grinding wheel can always be kept in the semiconductor material machining process, no third-party dressing tool is needed, and the stability of the workpiece machining quality can be greatly improved; and finally, the preparation method is simple, the preparation efficiency is high and the industrial production is easy.

Description

technical field [0001] The invention relates to the technical field of grinding wheel forming, in particular to a self-dressing grinding wheel for semiconductor material processing and its preparation method and application. Background technique [0002] In the grinding of semiconductor materials, especially wide-bandgap semiconductor materials, the grinding wheel is required to have extremely high grinding stability, otherwise it will affect the surface quality of the material after processing and the consistency of TTV and other indicators. The traditional grinding wheel needs to be dressed by external force to maintain its sharpness. Intermittent dressing leads to periodic changes in the state of the edge of the grinding wheel, and fluctuations in the processing quality of the workpiece surface. Online dressing can keep the grinding wheel always higher than the edge, but the abrasive falls off early, and the grinding time is short , greatly reducing the life of the grindi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D7/06B24D3/10B24D3/34B24D18/00
CPCB24D7/063B24D7/066B24D3/10B24D3/342B24D18/00
Inventor 牛俊凯张毅韩欣陈晓强李国伟时云鹏贺柳青
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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