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An automatic grinding and configuring device for conductive silver glue for LED production

A configuration device and technology of conductive silver glue, applied in the field of automatic grinding and configuration device of conductive silver glue for LED production, can solve the problems of inconvenient configuration of conductive silver glue, easy generation of bubbles and the like

Active Publication Date: 2021-09-21
NANJING LIUHE TECH VENTURE CAPITAL DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an automatic grinding and disposing device for conductive silver glue for LED production with small error, easy operation and automatic defoaming for the above-mentioned problems of inconvenient configuration of conductive silver glue and easy generation of bubbles

Method used

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  • An automatic grinding and configuring device for conductive silver glue for LED production
  • An automatic grinding and configuring device for conductive silver glue for LED production
  • An automatic grinding and configuring device for conductive silver glue for LED production

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Such as Figure 1-3 As shown, a conductive silver glue automatic grinding configuration device for LED production includes a configuration box 1, and a sieve plate 2 is slidably connected to the inner wall of the configuration box 1. It should be noted that the sieve plate 2 is a porous sieve plate. The inner side wall of the configuration box 1 is fixedly connected with a limiting plate 14, and the lower end of the limiting plate 14 is fixedly connected with the sieve plate 2 through a vibrating spring 15, and the lower end of the sieve plate 2 is provided with a foam breaking mechanism 3. The foam mechanism 3 includes a plurality of foam breaking needles 16 fixedly connected to the lower surface of the sieve plate 2 , and the plurality of foam breaking needles 16 are arranged on the lower surface of the sieve plate 2 in an annular array.

[0028] In this embodiment, an annular support plate 4 is fixedly connected to the inner side wall of the configuration box 1, and ...

Embodiment 2

[0036] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that the lower end of the lifting plate 11 is rotatably connected with a rotating rod 21, and the lower end of the rotating rod 21 runs through the annular support plate 4 and the sieve plate 2 in turn and is fixedly connected with a stirring impeller 23. , the annular support plate 4 is fixedly embedded with a threaded cylinder 22, the rotating rod 21 is provided with threads, the threaded cylinder 22 is sleeved outside the rotating rod 21 and is threaded with the rotating rod 21, and the rotating rod 21 is slidably connected with the sieve plate 2.

[0037] In this embodiment, when the heat-shrinkable memory spring 12 stretches, it drives the lifting plate 11 to move upwards, and then drives the rotating rod 21 to move upwards. Since the threaded cylinder 22 cannot rotate, the rotating rod 21 drives the stirring impeller 23 to rotate. The resin matrix is ​​stirred to ensure that the...

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Abstract

The invention belongs to the field of LED production equipment, and in particular relates to a conductive silver glue automatic grinding configuration device for LED production. A foam breaking mechanism is provided, and an annular support plate is fixedly connected to the inner side wall of the configuration box, and a grinding groove is fixedly connected to the inner ring side wall of the annular support plate, and the grinding groove and the sieve plate are both made of magnetic materials The same sex repels each other, the grinding tank is provided with a plurality of grinding holes that run through the grinding tank, the grinding ball is provided above the grinding tank, the grinding ball is provided with a storage chamber, and the grinding ball Set up to match the grinding tank. The invention can grind the silver powder with the grinding ball and the grinding tank, adjust the position of the grinding ball through the temperature generated during grinding to realize the automatic addition of the silver powder, and drive the sieve plate to move for defoaming operation, which is beneficial to the rapid configuration of the conductive silver glue.

Description

technical field [0001] The invention belongs to the field of LED production equipment, in particular to a conductive silver glue automatic grinding configuration device for LED production. Background technique [0002] The conductive silver glue combines the conductive particles together through the bonding effect of the matrix resin to form a conductive path and realize the conductive connection of the adhered materials. The conductive silver glue has been widely used in liquid crystal displays (LCDs), light-emitting diodes (LEDs), integrated The packaging and bonding of electronic components and components such as circuit (IC) chips, printed circuit board assemblies (PCBA), dot matrix blocks, ceramic capacitors, membrane switches, smart cards, and radio frequency identification has a tendency to gradually replace traditional soldering. [0003] When configuring the existing conductive silver glue, it is necessary to grind the flaky silver powder BAgF-20 and the granular si...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B02C15/00B02C23/16B02C23/00
CPCB02C15/00B02C23/00B02C23/16B02C2023/165
Inventor 黄树赞
Owner NANJING LIUHE TECH VENTURE CAPITAL DEV CO LTD
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