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A self-dressing grinding wheel for semiconductor material processing and its preparation method and application

A material processing and self-dressing technology, which is applied in metal processing equipment, bonded grinding wheels, abrasives, etc., can solve the problems of low grinding stability, difficulty in synchronous sintering, and difficulty in realization, achieving high preparation efficiency and easy industrial production , The effect of simple preparation method

Active Publication Date: 2022-07-01
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the technical problems of low grinding stability, poor service life and difficulty in improving the sharpness of the existing semiconductor grinding wheel, the present invention proposes a self-dressing grinding wheel for semiconductor material processing and its preparation method and application. First, through A metal-based fan-shaped abrasive layer is set on the grinding wheel base to ensure the grinding strength of the grinding wheel and play the role of grinding and support; secondly, a through hole is set on the metal-based fan-shaped abrasive layer, and the through hole is filled with a composite material solidification layer. Lower than the metal-based fan-shaped abrasive layer, it falls off from the through hole and spreads to the grinding surface during the grinding process, which acts like a grinding paste. It can not only repair the metal-based fan-shaped abrasive layer, but also keep it sharp state, it also plays an auxiliary grinding role on the workpiece, and can improve the processing quality of the workpiece surface; thirdly, under the interaction of the two structural layers, the grinding wheel can always maintain self-sharpening during the processing of semiconductor materials , without the need for a third-party dressing tool, greatly improving the stability of the workpiece processing quality. Finally, compared with the method of directly mixing metal, ceramics, and resin as a binder to improve the sharpness of the grinding wheel, the preparation method of the present invention avoids the need for metals, ceramics, etc. , There is a large difference in melting point between resin binders, it is difficult to sinter synchronously and the density difference is large, and the mixing is difficult to mix. The preparation method is simple, the preparation efficiency is high, and it is easy for industrial production

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  • A self-dressing grinding wheel for semiconductor material processing and its preparation method and application
  • A self-dressing grinding wheel for semiconductor material processing and its preparation method and application
  • A self-dressing grinding wheel for semiconductor material processing and its preparation method and application

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Embodiment 1

[0036] Embodiment 1, a kind of self-dressing grinding wheel for semiconductor material processing, such as figure 1As shown, it includes a grinding wheel base 1 and an abrasive layer, the abrasive layer includes a metal-based bond sector 2 and a composite material layer 3, the metal-based bond sector 2 is annularly arranged on the grinding wheel base 1, and the composite material layer 3 is arranged on the metal base In the through hole 4 on the bonding agent sector block 2 . When using the self-dressing grinding wheel for semiconductor material processing, firstly, the metal-based bond sector 2 ensures the grinding strength of the grinding wheel, and plays the role of grinding and support; The hole 4 is filled with the composite material layer 3. The strength of the composite material layer 3 is lower than that of the metal-based binder sector block 2. During the grinding process, the composite material layer 3 falls off from the through hole 4 and is dispersed and distribute...

Embodiment 2

[0051] Embodiment 2, a preparation method for preparing the above-mentioned self-dressing grinding wheel for semiconductor material processing in this embodiment, such as image 3 shown, including the following steps:

[0052] S1. Put tin powder, titanium powder, ferric oxide, organic pore-forming agent, diamond and copper powder into a mixer and mix evenly to obtain a mixture. Specifically, the raw materials for the preparation of the metal-based binder segment 2 are selected. In this embodiment, the mass percentage of tin powder is 25%, the mass percentage of titanium powder is 10%, the mass percentage of ferric oxide is 5%, and the organic The mass percentage of pore-forming agent is 5%, the mass percentage of diamond is 5%, and the mass percentage of copper powder is 50%. 43~48μm, the organic pore-forming agent selects polystyrene microspheres (PS microspheres), the particle size of the organic pore-forming agent is 80~100μm, and the raw materials are loaded into a three-...

Embodiment 3

[0061] Embodiment 3, a preparation method of a self-dressing grinding wheel for semiconductor material processing, the difference between this embodiment and Embodiment 2 is that in step S1 of this embodiment, the mass percentage of tin powder is 40%, and the mass percentage of titanium powder is 40%. The percentage is 6%, the mass percentage of ferric oxide is 3%, the mass percentage of organic pore-forming agent is 2%, the mass percentage of diamond is 4%, the mass percentage of copper powder is 45%, and the diamond particle size is 5~ 10 μm, the organic pore-forming agent is polymethyl methacrylate (PMMA), the particle size of the organic pore-forming agent is 7-14 μm, and the total mixing time is 3 hours; in step S2, the sintering temperature is 520 ° C, and the sintering pressure is is 180MPa, and the area of ​​the through hole 4 accounts for 40% of the total area of ​​the end face of the metal-based binder sector 2; in step S4, the CaSO 4 ·H 2The mass percentage of O po...

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Abstract

The invention provides a self-dressing grinding wheel for semiconductor material processing, a preparation method and application thereof, which are used to solve the technical problems of low grinding stability, poor life and difficult realization of improving the sharpness of the grinding wheel existing in the existing semiconductor grinding wheel. The metal-based fan-shaped abrasive layer of the invention ensures the grinding strength of the grinding wheel, and plays the role of grinding and support; the through hole is filled with a solidified layer of composite material, and the strength is lower than that of the metal-based fan-shaped abrasive layer, and plays a role similar to grinding paste, It can not only play the role of trimming the metal-based fan-shaped abrasive layer to keep it sharp, but also play a role in the auxiliary grinding of the workpiece and improve the processing quality of the workpiece surface; under the interaction of the two structural layers In the process of semiconductor material processing, the grinding wheel can always maintain self-sharpening without the need for third-party dressing tools, which greatly improves the stability of workpiece processing quality.

Description

technical field [0001] The invention relates to the technical field of grinding wheel forming, in particular to a self-dressing grinding wheel for semiconductor material processing and a preparation method and application thereof. Background technique [0002] In the grinding process of semiconductor materials, especially wide-bandgap semiconductor materials, the grinding wheel is required to have extremely high grinding stability, otherwise it will affect the surface quality and the consistency of TTV and other indicators after the material is processed. The traditional grinding wheel needs to be trimmed by external force to maintain its sharpness. Intermittent trimming leads to periodic changes in the edge state of the grinding wheel, and the surface processing quality of the workpiece fluctuates. On-line trimming can keep the grinding wheel in a state of being higher than the edge, but the abrasive falls off early and the grinding time is short. , greatly reducing the lif...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D7/06B24D3/10B24D3/34B24D18/00
CPCB24D7/063B24D7/066B24D3/10B24D3/342B24D18/00
Inventor 牛俊凯张毅韩欣陈晓强李国伟时云鹏贺柳青
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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