Display panel, manufacturing method and display device
A display panel, flat technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as bonding offset
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[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0032] As mentioned in the background technology, STAMP transfer bonding requires the use of the key material polydimethylsiloxane (Polydimethylsiloxane, PDMS), the temperature resistance of PDMS is 150 ° C, and the bonding process between Micro-LED and substrate is Au- In the eutectic process, the support temperature is generally about 170°C, which is higher than the temperature resistance temperature of PDMS, and the thermal expansion of PDMS will cause the bonding deviation between the Micro-LED and the substrat...
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