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Display panel, manufacturing method and display device

A display panel, flat technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as bonding offset

Active Publication Date: 2021-08-06
HUBEI YANGTZE IND INNOVAION CENT OF ADVANCED DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a display panel, a manufacturing method, and a display device, so as to solve the problem that the existing Micro-LED and substrate bonding easily cause bonding deviation question

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  • Display panel, manufacturing method and display device
  • Display panel, manufacturing method and display device
  • Display panel, manufacturing method and display device

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0032] As mentioned in the background technology, STAMP transfer bonding requires the use of the key material polydimethylsiloxane (Polydimethylsiloxane, PDMS), the temperature resistance of PDMS is 150 ° C, and the bonding process between Micro-LED and substrate is Au- In the eutectic process, the support temperature is generally about 170°C, which is higher than the temperature resistance temperature of PDMS, and the thermal expansion of PDMS will cause the bonding deviation between the Micro-LED and the substrat...

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Abstract

The invention discloses a display panel and a display device. The display panel comprises a substrate; a plurality of bonding electrodes are arranged on the substrate; a plurality of Micro-LEDs are arranged on one sides, far away from the substrate, of the bonding electrodes; the Micro-LEDs are electrically connected with the bonding electrodes in a one-to-one correspondence manner; in a plane parallel to the substrate, in the direction from the center of the substrate to the edge of the substrate, the size of each bonding electrode is gradually increased, and / or the distance between the centers of every two adjacent bonding electrodes is gradually increased, so that the Micro-LEDs are bonded with the corresponding bonding electrodes. With the display panel and the display device adopted, the problem that bonding deviation is easily caused by bonding of existing Micro-LEDs and a substrate in the prior art can be solved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a manufacturing method, and a display device. Background technique [0002] Micro-LED (also known as Micro-LED) display is to miniaturize the traditional LED structure. The size of a single Micro-LED chip is generally less than 50 microns, and it is combined with a pixel driving circuit to realize addressing control and individual driving of each pixel. display technology. Micro-LEDs retain the advantages of traditional LEDs in materials and devices, such as high brightness, high luminous efficacy, long life, high contrast, and nanosecond response time. At the same time, Micro-LED is prepared by semiconductor processing technology and is compatible with IC technology. It has extremely high device processing accuracy and stability, can achieve ultra-high resolution, and is easy to integrate with tactile, auditory, olfactory and other sensors to achieve h...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L25/075H01L27/15
CPCH01L33/48H01L33/62H01L25/0753H01L27/156H01L2933/0033H01L2933/0066H01L25/167
Inventor 葛树成
Owner HUBEI YANGTZE IND INNOVAION CENT OF ADVANCED DISPLAY CO LTD