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Rigid-flex board lens module

A technology of flexible and rigid boards and lens modules, applied in the field of lenses, can solve problems such as sudden cost increases, large tolerances, and no obvious features

Pending Publication Date: 2021-08-06
JIASHAN WANSHUNDA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its low reliability, the Hot Bar is basically not used at present; and ACF / ACP needs to purchase additional equipment, which makes the cost rise sharply
Moreover, traditional packaging technologies such as wafer-level packaging process are directly assembled according to the set tolerance parameters. As the number of superimposed parts increases, the final matching tolerance becomes larger and larger. The final shooting effect of the image is similar to that of ordinary COB. The process has no advantages and characteristics in the thickness of the module
The final lens installation also has no obvious features

Method used

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  • Rigid-flex board lens module
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Embodiment Construction

[0023] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0024] In the present invention, terms such as "installation", "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it may be a fixed connection or It is a detachable connection; it may be a mechanical connection; it may be a direct connection or an indirect connection through an intermediary. Those with ordinary knowledge in the technical field can understand the specific meanings of the above terms in the present invention according to specific situations.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first"...

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Abstract

The invention provides a rigid-flex board lens module. The rigid-flex board lens module comprises a rigid-flex board unit having two rigid circuit boards and a flexible circuit board combined between the two rigid circuit boards, a photosensitive element and a lens disposed on the flexible circuit board, and two gaps between the lens and the two rigid circuit boards is respectively filled with a gap glue. In this way, two joints between the flexible circuit board and the two rigid circuit boards are reinforced, and the rigid-flex board lens module becomes an integrated structure after the gap glues are cured.

Description

technical field [0001] The invention relates to the field of lenses, in particular to a lens module of a rigid-flex board. Background technique [0002] The camera lens is an important functional component of electronic products such as mobile phones, tablets, and notebooks. With the rapid development of this consumer industry, it also drives the high growth of the camera industry. Especially in the thinning of these electronic products, the size of the camera lens installed in the electronic products needs to be thinner. [0003] There are three packaging methods for traditional camera lens module packaging methods, namely: 1. Chip Scale Package (CSP) method, 2. Chip On Board (COB) method, 3. Inverted Flip Chip method. [0004] The advantage of CSP packaging is that the packaging section is completed by the front-end process, and the chip of CSP packaging is covered by glass, so it has lower requirements for cleanliness. The pass rate is also good, the cost of process eq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/0274H05K1/144
Inventor 程新莲鲍华男王伟权
Owner JIASHAN WANSHUNDA ELECTRONICS CO LTD