Novel high-density board edge bonding pad and processing method thereof
A high-density board and pad technology, which is applied to the formation of electrical connection of printed components, electrical connection of printed components, printed circuit components, etc., can solve the problems of limited pad size and pad spacing, and achieve the Flexible and adjustable pitch, reliable connection, fine pad width and pad pitch effect
Pending Publication Date: 2021-08-06
北京图力普联科技有限公司
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Problems solved by technology
[0006] The invention provides a new high-density board edge pad and its processing method, which solves the problem that the size and pad spacing of the existing board edge pad are limited by the processing method
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[0044] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0045] Please refer to figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 ,in, figure 1 A structural schematic diagram of a preferred embodiment of a new high-density board edge pad and its processing method provided by the present invention; figure 2 for figure 1 The structural schematic diagram of the PCB board shown; image 3 for figure 1 Schematic diagram of the structure of the drilling device shown; Figure 4 for image 3 Schematic diagram of the structure of the processing device shown; Figure 5 for image 3 Schematic diagram of the structure of the flue gas treatment device shown; Figure 6 for image 3 The structural schematic diagram of the cooling device shown; Figure 7 for image 3 Schematic diagram of the structure of the collection device shown; Figure 8 for ...
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The invention provides a novel high-density board edge bonding pad processing method. The method comprises the following steps: 1, designing packaging of PCB board edge bonding pads, wherein the packaging width has various specifications, and the width of the bonding pads packaged on the upper surface and the lower surface of a PCB is b; 2, arranging the board edge bonding pads on the board edges, where the board edge bonding pads need to be designed, of the PCB, wherein the distance c between the bonding pads follows the rule; and 3, designing a distribution forbidding area between the board edge bonding pads arranged in step 2 so as to prevent the circuit from being damaged when the circuit is designed to the area and the gap between the bonding pads is milled by a milling machine subsequently in the PCB design. According to the novel high-density board edge bonding pad and the processing method thereof, the high-density bonding pad is suitable for both welding and crimping, is particularly suitable for manufacturing a crimping bonding pad, can realize low-cost reliable connection of boards to boards in cooperation with a pressure-sensitive conductive adhesive, is flexible and adjustable in bonding pad width and bonding pad spacing, and is completely compatible with an existing PCB processing and manufacturing process, and the width of the bonding pad and the distance between the bonding pads can be manufactured to be finer.
Description
technical field [0001] The invention relates to the field of pad processing, in particular to a new high-density board edge pad and a processing method thereof. Background technique [0002] Pad, the basic constituent unit of surface mount assembly, is used to form the pad pattern of the circuit board, that is, various pad combinations designed for special component types. [0003] At present, pads are processed in two ways: semi-hole pads and flat pads on the edge of the board. These two types of edge pads are mostly used for the production of edge pads on module boards, mainly on module boards. The edge is used to solder the module board to the carrier board, which is mainly used for the board edge pad production of the mobile terminal motherboard. [0004] The size and pitch of the existing pads on the edge of the board are limited by the processing method, so they cannot be made smaller, and cannot meet the development of modern PCBs towards higher density and higher in...
Claims
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Login to View More IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/111H05K3/40
Inventor 郭江峰李帅
Owner 北京图力普联科技有限公司