Substrate cleaning solution, method for manufacturing cleaned substrate by utilizing the same, and method for manufacturing device
A technology for cleaning liquids and substrates, applied in the preparation of detergent mixture compositions, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve problems such as insufficient removal, particle residue, and insufficient particle removal, and achieve elimination Effect of process control and detachment prevention
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0141] Preparation of patterned substrates
[0142] The KrF resist composition (AZ DX-6270P, Merck Performance Materials Co., Ltd., hereinafter referred to as MPM) was dropped onto an 8-inch Si substrate, and the substrate was spin-coated at a speed of 1500 rpm. The substrate was soft baked at 120°C for 90 seconds. Use KrF stepper (FPA-3000 EX5, Canon), at 20mJ / cm 2 For exposure, perform PEB (post-exposure bake) at 130° C. for 90 seconds, and develop with a developer (AZ MIF-300, manufactured by MPM). A resist pattern having a pitch of 360 nm and a line pitch of 1:1 was thus obtained. Using the resist pattern as an etching mask, the substrate was etched with a dry etching device (NE-5000N, ULVAC). Then, the substrate was cleaned with a stripper (AZ 400T, MPM Corporation) to strip the resist pattern and resist residue. This resulted in a patterned substrate with a pattern with a pitch of 360 nm, a duty ratio of 1:1 and a line height of 150 nm.
[0143] Preparation of B...
preparation example 1
[0157] Phenolic resin (Mw about 300) was used as (A) insoluble or poorly soluble solute, and 2,2-bis(4-hydroxyphenyl)propane was used as (B) soluble solute.
[0158] 2,2-bis(4-hydroxyphenyl)propane was weighed so that it might be 5 mass % with respect to a phenol resin (Mw about 300). A total of 5 g of these materials was added to 95 g of IPA ((C) solvent). This was stirred with a stirrer for 1 hour to obtain a liquid having a solid content concentration of 5% by mass.
[0159] The liquid was filtered through Optimizer UPE (Japan Entegris Co., Ltd., UPE, pore size 10 nm). Cleaning liquid 1 is thus obtained. It is listed in Table 1.
[0160] In Table 1 below, the numbers in parentheses in column (B) indicate the concentration (% by mass) of (B) soluble solutes compared to (A) insoluble or poorly soluble solutes.
[0161] Table 1
[0162]
[0163]
[0164] In the above table, they are abbreviated as follows.
[0165] Phenolic resin (Mw about 300) A1,
[0166] Phenol...
PUM
| Property | Measurement | Unit |
|---|---|---|
| boiling point | aaaaa | aaaaa |
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More