High-barrier spunbonded new semiconductor material preparation equipment

Abstract

The invention discloses high-barrier spunbonded new semiconductor material preparation equipment. The equipment is structurally provided with a bottom plate, a material placing plate, an operation frame, a control frame, a guide rail and a motor, wherein the material placing plate is fixedly installed at the top of the bottom plate, the operation frame is slidably connected to the bottom plate, the control frame is connected to the side position of the operation frame and movably matched with the operation frame, the motor is installed on one side above the bottom plate, a displacement block slides downwards through inertia force, a penetrating rod pushes an arc block at the lower end downwards, a magnetic field force between the arc blocks at the upper end and the lower end is changed, the arc block at the upper end can descend conveniently, the penetrating rod can extend downwards to a better limit, the displacement block can better drive an abutting frame to move downwards by a longer distance, and through the dragging property of a pulled block, the pulled block is pulled to extend along with the displacement of the arc blocks, so that spring steel can better generate lateral jacking force on a movable ring, the movable ring generates impact force on the two sides, the impact force is transmitted to the abutting frame, the abutting frame is further assisted in generating vibration on a film material after abutting against the film material, and the film material is separated from the abutting frame.

Description

technical field [0001] The invention belongs to the field of semiconductor new material preparation, and more specifically relates to a high-barrier spun-bonded semiconductor new material preparation equipment. Background technique [0002] With the continuous development of modern industrial technology, the development and application of new materials have gradually occupied an important position. High barrier PVDC film is one of the new high barrier spunbonded semiconductor materials. Its superior characteristics make it widely used in the packaging field. Widely used, it needs to be punched in the production and preparation process to make it more convenient to use in people's lives. [0003] Based on the inventor's discovery above, the existing high-barrier spunbonded semiconductor new material preparation equipment has the following deficiencies: [0004] When the film drilling equipment is drilling the pvdc film, because the film material is relatively soft, it is not...

AI Technical Summary

Problems solved by technology

[0004] When the film drilling equipment is drilling the pvdc film, because the film material is relatively soft, it is not easy to leave the drilling head in time after it contacts the drilling head, but it is easy to be lifted up with the drilling head movement, and the personnel still The film material needs to be pressed back down, which increases the workload of personnel

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