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A thickness analysis method, system, device and storage medium based on surface offset

An analysis method and thickness value technology, applied in the field of model analysis, can solve the problems of inaccurate analysis results and affect the thickness analysis results, and achieve the effect of reducing analysis errors and improving analysis accuracy.

Active Publication Date: 2021-11-19
ZWCAD SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the rolling ball method has relatively high requirements on the quality of the model. If there is an error in the model, it will directly affect the thickness analysis results, resulting in inaccurate analysis results.

Method used

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  • A thickness analysis method, system, device and storage medium based on surface offset
  • A thickness analysis method, system, device and storage medium based on surface offset
  • A thickness analysis method, system, device and storage medium based on surface offset

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Experimental program
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Embodiment 1

[0044] This embodiment provides a thickness analysis method based on surface offset, which replaces the traditional ray method or rolling ball method for thickness analysis by surface offset, which can improve the accuracy of thickness analysis and reduce the quality of the model. analysis error, improve the accuracy of thickness analysis.

[0045] Such as figure 1 , figure 2 As shown, the thickness analysis method based on surface offset in this embodiment specifically includes the following steps:

[0046] Step S1: mark sampling points on the model surface according to preset setting parameters;

[0047] Step S2: Perform multiple surface migrations on all surfaces of the model along the anti-normal direction of the model surface, and record the total offset value corresponding to the sampling point when the model surface self-intersects during the multiple surface migration process;

[0048] Step S3: Obtain the thickness value of the model position corresponding to each ...

Embodiment 2

[0061] This embodiment provides a thickness analysis system based on plane offset, the analysis system implements the thickness analysis method based on plane offset described in Embodiment 1, as Figure 6 As shown, the analysis system of this embodiment specifically includes the following modules:

[0062] A marking module is used to mark sampling points on the model surface according to the input setting parameters;

[0063] The analysis module is used to perform multiple surface migrations on all surfaces of the model along the antinormal direction of the model surface, and record the total offset value corresponding to the sampling point when the model surface self-intersection occurs during the multiple surface migration process; according to the total The offset value obtains the thickness value of the model position corresponding to each sampling point;

[0064] The output module is used to output the model thickness analysis result according to the thickness value.

Embodiment 3

[0066] This embodiment provides an electronic device, which includes a processor, a memory, and a computer program stored on the memory and operable on the processor. When the processor executes the computer program, the first embodiment is implemented. In addition, this embodiment also provides a storage medium on which a computer program is stored, and when the computer program is executed, the above-mentioned thickness analysis method based on surface offset is realized.

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Abstract

The invention discloses a thickness analysis method, system, equipment and storage medium based on surface offset. The thickness analysis method includes marking sampling points on the model surface according to preset setting parameters; Perform multiple surface migrations on all surfaces of the model, and record the total offset value corresponding to the sampling point when the model surface self-intersects during the multiple surface migration process; obtain the thickness value of the model position corresponding to each sampling point according to the total offset value , and output the model thickness analysis results according to the thickness value. The invention analyzes the thickness of the model by intersecting the surface of the model through multiple surface offsets, replacing the original thickness measurement method of the ray method, which can improve the accuracy of the model thickness analysis; at the same time, the method of using the surface offset allows the model to The internal bias shrinks, making the model error gap smaller or disappear, reducing the analysis error caused by the model error.

Description

technical field [0001] The invention relates to the field of model analysis, in particular to a thickness analysis method, system, equipment and storage medium based on surface offset. Background technique [0002] Thickness analysis plays an important role in product design as well as mold design. In the current 3D software, the mainstream thickness analysis methods include ray method and rolling ball method. [0003] The ray method is to calculate the normal direction of a point on the model, follow the normal direction to another point of the model, and calculate the distance between the two points as the thickness. The disadvantage of this method is that when the end point that needs to calculate the model thickness has a large model width-to-height ratio in the normal direction, there is a large difference between the thickness value calculated by the ray method and the actual thickness value. [0004] The rolling ball method calculates the tangent ball of a point on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/20G06T7/90G01B21/08
CPCG01B21/08G06T7/90G06F30/20
Inventor 周晋航何锦其薛克亮李会江冯征文
Owner ZWCAD SOFTWARE CO LTD