Electronic information engineering component integrated packaging operation system

A technology of electronic information and operating system, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as electrical performance degradation

Inactive Publication Date: 2021-08-20
杨丽
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because the chip must be isolated from the outside world to prevent impurities in th

Method used

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  • Electronic information engineering component integrated packaging operation system
  • Electronic information engineering component integrated packaging operation system
  • Electronic information engineering component integrated packaging operation system

Examples

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Embodiment Construction

[0040] Embodiments of the technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and therefore are only examples, rather than limiting the protection scope of the present invention.

[0041] Such as Figure 1-8 As shown in , an integrated packaging operation system for electronic information engineering components includes an operating platform 1, and automatic packaging manipulators 2 are respectively installed on the ground outside each side of the operating platform 1, and each of the automatic packaging manipulators 2 are all controlled by an external control terminal. Several component locking and fixing devices 3 are installed in an array at intervals in the operating platform 1. The actions of each of the component locking and fixing devices 3 are independent of each other, and each of th...

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Abstract

The invention relates to the technical field of component packaging, in particular to an electronic information engineering component integrated packaging operation system which comprises an operation platform, automatic packaging manipulators are installed on the ground in the outer sides of all edges of the operation platform respectively, and all the automatic packaging manipulators are controlled by an external control terminal. A plurality of component locking and fixing devices are installed in the operation platform at intervals in an array mode, actions of the component locking and fixing devices are mutually independent, and the component locking and fixing devices can be used for locking and fixing components of different sizes. Each component locking and fixing device is mounted on the operation platform in a detachable fixing manner. According to the system, an integrated structure is adopted, a plurality of component locking and fixing devices are integrally installed on the operation platform, efficient packaging of components can be achieved, and corresponding packaging of all the components can be achieved by controlling all the automatic packaging manipulators in the operation process.

Description

technical field [0001] The invention relates to the technical field of component packaging, in particular to a new structural system capable of fast integrated packaging for engineering components, especially an integrated packaging operation system for electronic information engineering components. Background technique [0002] In the electronic information engineering industry, components belong to the basic unit of electronic circuits. Whether it is the composition of pure circuits or the composition of electronic information control-related circuits, electronic components are inseparable. Electronic components are electronic components and small machines and instruments. Components, which are often composed of several parts, can be used in common products of the same kind; often refer to certain parts in industries such as electrical appliances, radios, and instruments, and are the general term for electronic devices such as capacitors, transistors, hairsprings, and sprin...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67121H01L21/68764
Inventor 杨丽
Owner 杨丽
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