Soaking structure and electronic equipment

Abstract

The invention discloses a soaking structure which comprises a plate body. The plate body is provided with a heating area and a condensation area located on the periphery of the heating area, the heating area is used for being connected with a heating source, the plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures, and the first capillary structures are radially distributed towards the condensation area with the heating area as the center; a first liquid channel is formed in the first capillary structure, the second capillary structure extends to the condensation area from the first capillary structure in the first direction or the second direction of the plate body, a second liquid channel is formed in the second capillary structure, a gas channel is formed between every two adjacent capillary structures, and the first direction is perpendicular to the second direction; and the first capillary structures are radially distributed towards the condensation area with the heating area as the center, the liquid backflow path can be shortened, the second capillary structures extend in the first direction or the second direction, and the distribution planning and design difficulty of the second capillary structures on the plate body can be lowered. In addition, the invention also discloses electronic equipment comprising the soaking structure.

Description

technical field [0001] The invention relates to the technical field of heat dissipation structures, in particular to a heat uniform structure and electronic equipment. Background technique [0002] During the use of electronic equipment, the electronic devices in the electronic equipment will generate a lot of heat, which will lead to an increase in the ambient temperature of the electronic devices. However, the electronic devices will be in a high temperature environment for a long time, which will shorten the service life of the electronic devices. . In related technologies, in order to take into account the light and thin design of electronic equipment, VC (Vapor Chamber, vacuum chamber thermal structure heat dissipation technology) thermal structure is often used to dissipate heat from electronic devices (such as chips, batteries, etc.), the VC thermal structure mainly It includes an upper heat conduction sheet and a lower heat conduction sheet, a closed cavity is forme...

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Problems solved by technology

However, since the working cavity is a closed cavity, the working fluid interferes with the phase transition process of liquid and gas in the closed cavity, which affects the heat conduction rate in the closed cavity, and then affects the heat dissipation effect of the heat-spreading structure.

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