Chip wafer temporary storage device and chip wafer temporary access method

Abstract

The invention discloses a chip wafer temporary storage device and a chip wafer temporary access method. The chip wafer temporary storage device comprises a box body and an access unit. The box body comprises a bottom shell and a top plate. The access unit is arranged on the upper end face of the inner bottom wall of the bottom shell and comprises a conveying mechanism and a storage mechanism; the conveying mechanism comprises a first wafer fixing device, the storage mechanism comprises a plurality of storage layers, a plurality of clamping mechanisms are arrayed on the upper end faces of the storage layers, and the storage mechanism further comprises a second wafer fixing device. The chip wafer temporary storage method adopting the chip wafer temporary storage device comprises a wafer temporary storage step, a wafer obtaining step and the like. The chip wafer temporary storage device can be suitable for chip wafers with different diameters, can independently monitor and adjust the environment of the area close to the chip wafer temporary storage distance, reduces the influence of the environment outside the box on the interior of the box as much as possible, and is simple in structure and flexible in function; the chip wafer temporary storage method adopting the chip wafer temporary storage device is simple, convenient to operate and capable of achieving automation.

Description

technical field [0001] The present invention relates to chip wafer temporary storage, in particular to a chip wafer temporary storage device and a chip wafer temporary storage and pick-up method. Background technique [0002] Common chip wafers have different specifications such as 12 inches and 8 inches. They generally need to be temporarily stored after the production is completed. The temporarily stored wafers need to be taken out after a period of time. The existing chip wafers are usually temporarily stored in the vertical In the chip stacking box that is stacked directly, and then placed in the warehouse, the chip wafer is directly packed into the box for temporary storage. When the stacking box is shaken, it is not easy to fix the wafer, and when the wafer is temporarily stored and taken, prone to breakage. In addition, wafer access is inconvenient. [0003] Chip wafer temporary storage has high environmental requirements, including air pressure, humidity, temperatu...

AI Technical Summary

Problems solved by technology

[0002] Common chip wafers have different specifications such as 12 inches and 8 inches. After the production is completed, they generally need to be temporarily stored. The temporarily stored wafers need to be taken out after a period of time. The existing chip wafers are usually temporarily stored in vertical In the chip stacking box that is stacked directly, and then placed in the warehouse, the chip wafer is directly packed into the box for temporary storage. When the stacking box is shaken, it is not easy to fix the wafer, and when the wafer is temporarily stored and taken, prone to breakage

In addition, wafer access is inconvenient

[0003] Chip wafer temporary storage has high environmental requirements, including air pressure, humidity, temperature, etc. The existing chip temporary storage technology tries to meet the environmental requirements of chip wafer temporary storage by controlling the air pressure, humidity, and temperature of the warehouse as a whole. However, the area of ​​the warehouse is usually large, and it is difficult to ensure that the air pressure, humidity, and temperature of each location meet the requirements, and because the chip wafers in the warehouse are packed and stored, the air pressure, humidity, and temperature in the stacking box may not be consistent with the environment in the warehouse , the monitored environmental data in the warehouse may be inconsistent with the environment in which the wafer is located, which will affect the quality of the wafer or even damage it

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