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A kind of led lamp bead

A technology of LED lamp beads and LED chips, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of silicone inflow, pass through, and improve the difficulty of packaging silicone at the output end, and achieve the effect of improving convenience.

Active Publication Date: 2022-05-31
SHENZHEN AUROLED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned related technologies, the inventor believes that there are the following defects: the output end of the LED chip needs to be immersed in the packaging silica gel, and because the lamp bead base is small in size, the top surface of the lamp bead base is easily covered by the silica gel during the immersion packaging process. However, the silica gel flows into the installation groove, which increases the difficulty of packaging the silica gel at the output end.

Method used

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  • A kind of led lamp bead
  • A kind of led lamp bead
  • A kind of led lamp bead

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Embodiment 1

[0037] Referring to FIG. 2, the LED lamp bead includes a lamp bead base 1, and the lamp bead base 1 is made of glass fiber, mainly epoxy resin.

[0039] Referring to FIG. 2, four groups of LED chips 2 are provided in the installation groove 11, and the four groups of LED chips 2 are all LED lamp beads. Among them, four

[0042] In addition, the installation groove 11, which is narrow at the bottom and wide at the top, can reduce the usage of the encapsulation adhesive layer 12; and the installation groove 11 is notched.

[0043] Referring to Figure 2, the groove bottom end corner of the installation groove 11 is set as a rounded corner. The bottom end corner of the installation groove 11 groove set with rounded corners can reduce the

[0045] Referring to FIG. 2 , the output ends of the LED chips 2 are dispersedly arranged on the bottom surface of the lamp bead base 1 . Scattered LED chips 2

Embodiment 2

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Abstract

The present application relates to an LED lamp bead, which relates to the technical field of lamps. The packaging adhesive layer of the LED chip, the output end of the LED chip is pierced through the lamp bead base and placed on the bottom surface of the lamp bead base, and the output end of the LED chip is encapsulated with protective glue. The application has the effect of facilitating the packaging of silica gel at the output end of the LED chip.

Description

An LED lamp bead technical field [0001] The present application relates to the technical field of lamps, in particular to an LED lamp bead. Background technique LED is a solid-state semiconductor device, which can convert electrical energy into light energy, and has the advantages of low power consumption, high luminous efficiency, high It has the advantages of good light effect, fast response speed, strong controllability, high impact force, long service life and environmental protection. [0003] Referring to FIG. 1, the related art discloses a LED lamp bead, including a lamp bead base, and an installation is provided on the lamp bead base. The LED chip is fixedly connected in the installation groove, and the output end of the LED chip penetrates the lamp bead base and is placed on the side wall of the lamp bead base. For the above-mentioned related technology, the inventor thinks that there is the following defect: the LED chip output end needs to be immersed and se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/52H01L33/62
CPCH01L33/54H01L33/52H01L33/62
Inventor 蒋顺才张慧萍田丰
Owner SHENZHEN AUROLED TECH