A kind of hot pressing device for processing printed circuit board and processing technology of printed circuit board
A technology for printed circuit boards and hot pressing devices, applied in the directions of printed circuits, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve the problems of high temperature of multilayer boards, influence of processing environment, burns, etc. The effect of PCB board damage and efficiency improvement
Active Publication Date: 2022-07-01
恩达电路(深圳)有限公司
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Problems solved by technology
[0006] Aiming at the deficiencies of the prior art, the present invention provides a hot pressing device for processing printed circuit boards, which has the advantages of rapid heat dissipation, automatic discharge, and purification of toxic gases, and solves the problem that a large amount of toxic gases have a greater impact on the processing environment At the same time, the temperature of the multi-layer board formed after hot pressing is relatively high, and it is easy to cause burns when taking it out
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[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0034] As described in the background art, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a hot pressing device for processing printed circuit boards.
[0035] see Figure 1-6, a heat-pressing device for printed circuit board processing, comprising a base 1, a T-shaped frame 2 is fixedly connected to one side of the upper surface of the base 1, and a frame 3 i...
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The invention relates to the technical field of printed circuit board processing, and discloses a heat-pressing device for processing printed circuit boards and a processing technology, comprising a base, a T-shaped frame is fixedly connected to one side of the upper surface of the base, and the upper surface of the T-shaped frame is fixedly connected with a T-shaped frame. A frame is fixedly connected to one side, a motor is fixedly connected to the upper surface of the frame, a screw rod is fixedly connected to the rotating shaft of the motor through the frame, and the screw rod penetrates and rotates to connect the T-shaped frame. In the present invention, when the upper pressure box is lowered, the second screw sleeve synchronously descends, and when the upper pressure box rises, the second screw sleeve rises synchronously to lift the hot-pressing bottom plate, which plays the role of automatic feeding, and reduces the high temperature during material reclaiming. The risk of scalding, in which the ratio and direction of the helical gear 1, helical gear 2, helical gear 3, and helical gear 4 are changed to achieve a proportional relationship between the lifting height of the upper pressure box and the screw sleeve 2, realizing automatic linkage and improving. The automation degree of the hot pressing device is improved, and the production efficiency is indirectly improved.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a hot pressing device for printed circuit board processing and a printed circuit board processing technology. Background technique [0002] The printed circuit board, also known as the PCB board, realizes the electrical connection between the component pins through the printed wires, solder tabs and metallized vias on the printed circuit board. Through a certain process, a layer of copper film with good electrical conductivity is covered on the substrate with high insulation, which constitutes the material necessary for the production of printed circuit boards - copper clad laminate. According to the circuit requirements, the conductive pattern is etched on the copper clad plate, and the component pin mounting holes, the via holes for electrical interconnection and the screw holes required for fixing the entire circuit board are drilled, and the printing ...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 吕忠韩飞
Owner 恩达电路(深圳)有限公司