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Fixing device for dispensing of electronic chip

A technology for fixing devices and electronic chips. It is applied to devices and coatings that apply liquid to the surface. It can solve the problems of the wrong position of the glue dispenser, waste, affecting the heat dissipation and service life of the chip, and prevent coating. The effect of non-uniform glue, high degree of automation, and cost saving of gluing

Inactive Publication Date: 2021-08-27
佛山市西迈智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a fixing device for electronic chip dispensing, which has the advantages of simple operation, avoiding the waste of dispensing, increasing the cost of use, and saving costs. During the process of gluing, the chip is manually placed, which will cause the position of the chip to be glued to be uncertain. At the same time, the chip will slosh while dispensing, which will cause the dispensing position of the glue dispenser to be wrong, resulting in waste and affecting the follow-up of the chip. Heat dissipation and service life, increasing the cost of use

Method used

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  • Fixing device for dispensing of electronic chip
  • Fixing device for dispensing of electronic chip
  • Fixing device for dispensing of electronic chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] see figure 1 with figure 2 , a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the inside of the transmission mechanism 2 is movably connected with an upper seat 21, and the inside of the upper seat 21 is provided with a chute 22, The diameter of the chute 22 is equal to the diameter of the movable block 27, and the movable block 27 is plugged into the inside of the upper seat 21, the shape and size of the positive plate 23 and the negative plate 24 are the same, and the length of the dielectric plate 28 is equal to the length of the negative plate 24 The positive plate 23 and the negative plate 24 are symmetrical about the dielectric plate 28, the positive plate 23 is movably connected to the outside of the chute 22, the negative plate 24 is movably connected to the outside of the chute 22, and the piezoresistor-25 is movably connected to the inside of th...

Embodiment 2

[0029] see figure 1 with image 3 , a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the bottom of the connecting rod 1 is movably connected with a fixing mechanism 3, and the top of the fixing mechanism 3 is movably connected with a magnetic There are four magnetostrictive rods 4 and four magnetostrictive rods, which are respectively located outside the chip to be glued. The four magnetostrictive rods 4 can push the chip to the position where the glue is applied to prevent the dispensing machine from unevenly applying glue or chip Chip waste caused by incorrect position, the inside of the fixing mechanism 3 is movably connected to the base 31 , the inside of the base 31 is movably connected to the electromagnetic plate 32 , the inside of the base 31 is movably connected to the airbag 33 , and the outside of the airbag 33 is movably connected to the magnetic bloc...

Embodiment 3

[0032] see Figure 1-4, a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the inside of the transmission mechanism 2 is movably connected with an upper seat 21, and the inside of the upper seat 21 is provided with a chute 22, The diameter of the chute 22 is equal to the diameter of the movable block 27, and the movable block 27 is plugged into the inside of the upper seat 21, the shape and size of the positive plate 23 and the negative plate 24 are the same, and the length of the dielectric plate 28 is equal to the length of the negative plate 24 The positive plate 23 and the negative plate 24 are symmetrical about the dielectric plate 28, the positive plate 23 is movably connected to the outside of the chute 22, the negative plate 24 is movably connected to the outside of the chute 22, and the negative plate 24 is electrically connected to the piezoresistor-25, T...

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Abstract

The invention relates to the technical field of electronic elements, and discloses a fixing device for dispensing of an electronic chip. The fixing device comprises a connecting rod, the top of the connecting rod is movably connected with a transmission mechanism, the bottom of the connecting rod is movably connected with a fixing mechanism, and the top of the fixing mechanism is movably connected with a magnetostrictive rod. An upper seat is movably connected to the interior of the transmission mechanism, a positive plate is movably connected to the outer side of a sliding groove, and a negative plate is movably connected to the outer side of the sliding groove. According to the fixing device for dispensing of the electronic chip, when a movable block moves downwards, a dielectric plate moves downwards, the current between the positive plate and the negative plate is larger than the minimum access voltage of a first piezoresistor, the first piezoresistor is connected, the magnetostrictive rod is magnetically connected with an electromagnetic plate, the electromagnetic plate is electrically connected with the first piezoresistor, and at the moment, the magnetostrictive rod extends to push the chip to a gluing position, so that chip waste caused by non-uniform gluing of a dispensing machine or an incorrect chip position is prevented, and the gluing cost is saved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a fixing device for electronic chip dispensing. Background technique [0002] An integrated circuit is a kind of microelectronic device or component. It uses a certain process to interconnect components such as transistors, diodes, resistors, capacitors, and inductors required in a circuit, and interconnects them in one or several small semiconductors. On a chip or a dielectric substrate, and then packaged in a tube shell, it becomes a microstructure with the required circuit function, in which all components have been structurally integrated, making electronic components towards miniaturization, low power consumption and high reliability. This is a big step forward. The chip needs to be bonded with a plastic cover on the top before use to protect the die inside the chip from being scratched or damaged by high temperature. [0003] When sticking the plastic cover, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02
CPCB05C13/02
Inventor 缪奥
Owner 佛山市西迈智能科技有限公司