Fixing device for dispensing of electronic chip
A technology for fixing devices and electronic chips. It is applied to devices and coatings that apply liquid to the surface. It can solve the problems of the wrong position of the glue dispenser, waste, affecting the heat dissipation and service life of the chip, and prevent coating. The effect of non-uniform glue, high degree of automation, and cost saving of gluing
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Embodiment 1
[0026] see figure 1 with figure 2 , a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the inside of the transmission mechanism 2 is movably connected with an upper seat 21, and the inside of the upper seat 21 is provided with a chute 22, The diameter of the chute 22 is equal to the diameter of the movable block 27, and the movable block 27 is plugged into the inside of the upper seat 21, the shape and size of the positive plate 23 and the negative plate 24 are the same, and the length of the dielectric plate 28 is equal to the length of the negative plate 24 The positive plate 23 and the negative plate 24 are symmetrical about the dielectric plate 28, the positive plate 23 is movably connected to the outside of the chute 22, the negative plate 24 is movably connected to the outside of the chute 22, and the piezoresistor-25 is movably connected to the inside of th...
Embodiment 2
[0029] see figure 1 with image 3 , a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the bottom of the connecting rod 1 is movably connected with a fixing mechanism 3, and the top of the fixing mechanism 3 is movably connected with a magnetic There are four magnetostrictive rods 4 and four magnetostrictive rods, which are respectively located outside the chip to be glued. The four magnetostrictive rods 4 can push the chip to the position where the glue is applied to prevent the dispensing machine from unevenly applying glue or chip Chip waste caused by incorrect position, the inside of the fixing mechanism 3 is movably connected to the base 31 , the inside of the base 31 is movably connected to the electromagnetic plate 32 , the inside of the base 31 is movably connected to the airbag 33 , and the outside of the airbag 33 is movably connected to the magnetic bloc...
Embodiment 3
[0032] see Figure 1-4, a fixing device for electronic chip dispensing, comprising a connecting rod 1, the top of the connecting rod 1 is movably connected with a transmission mechanism 2, the inside of the transmission mechanism 2 is movably connected with an upper seat 21, and the inside of the upper seat 21 is provided with a chute 22, The diameter of the chute 22 is equal to the diameter of the movable block 27, and the movable block 27 is plugged into the inside of the upper seat 21, the shape and size of the positive plate 23 and the negative plate 24 are the same, and the length of the dielectric plate 28 is equal to the length of the negative plate 24 The positive plate 23 and the negative plate 24 are symmetrical about the dielectric plate 28, the positive plate 23 is movably connected to the outside of the chute 22, the negative plate 24 is movably connected to the outside of the chute 22, and the negative plate 24 is electrically connected to the piezoresistor-25, T...
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