Thermosiphon radiator, system and application

Abstract

A thermosyphon radiator comprises a first pipe body, a second pipe body, a third pipe body, a fourth pipe body, a heat conduction pipe, a substrate, a first connecting pipe, a heat exchange pipe and a second connecting pipe. The third pipe body and the fourth pipe body are located between the first pipe body and the second pipe body in the vertical direction. The heat conduction pipe communicates with the fourth pipe body and the first pipe body. The substrate is in contact with the heat conduction pipe and is used for installing a heating device. The first connecting pipe is communicated with the first pipe body and the third pipe body. The heat exchange pipe is communicated with the third pipe body and the second pipe body. The second connecting pipe is communicated with the second pipe body and the fourth pipe body. Compared with the prior art, the thermosyphon radiator has the advantages that the structure is simplified, and the cost is reduced; in addition, the flowing direction of the refrigerant in the thermosyphon radiator is clearer, and the heat dissipation performance can be improved. The invention further discloses a thermosyphon heat dissipation system and application of the thermosyphon heat dissipation device in the field of chip heat dissipation.

Description

technical field [0001] The invention relates to a thermosiphon radiator, system and application, and belongs to the technical field of heat dissipation. Background technique [0002] With the continuous development of electronic components (such as chips), higher and higher requirements are put forward for heat dissipation. In the prior art, heat sinks are usually used for heat dissipation of electronic components. However, due to the limited heat dissipation performance of the heat sink itself, it has become increasingly difficult to meet the heat dissipation requirements. [0003] In the related art, there is also a technical solution of using the condenser in the refrigeration system to exchange heat with electronic components to realize heat dissipation. A refrigeration system usually includes a compressor, a throttling element, an evaporator, and a condenser. At this time, the shortcomings of the refrigeration system, such as many components, large volume, high cost, ...

AI Technical Summary

Problems solved by technology

At this time, the shortcomings of the refrigeration system, such as many components, large volume, high cost, and complicated layout, are undoubtedly exposed, and it is also unable to meet the heat dissipation needs.

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