A method for making a stepped groove and a circuit board

A manufacturing method and a technology of stepped grooves, which are applied to printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve problems such as size errors of stepped grooves, uneven surface of groove bottom graphics, etc., and achieve the effect of improving manufacturing accuracy

Active Publication Date: 2022-07-12
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for making a stepped groove, which can solve the problems of errors in the size of the stepped groove and uneven surface of the groove bottom when one of the vertical side walls of the stepped groove is demetallized

Method used

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  • A method for making a stepped groove and a circuit board
  • A method for making a stepped groove and a circuit board
  • A method for making a stepped groove and a circuit board

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Embodiment Construction

[0049] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0050] Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary ski...

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Abstract

The invention discloses a method for manufacturing a stepped groove and a circuit board, and relates to the technical field of manufacturing printed circuit boards. In this method, a copper layer is pre-laid at the area where the bottom of the stepped groove is formed; the metallized sidewall of the stepped groove is grooved until part of the copper layer at the bottom of the stepped groove is exposed, so as to form a groove and avoid the depth of the stepped groove Errors occur; electroplating copper layers on each surface of the groove; remove the core board between the second sidewall and the non-metallized sidewall of the stepped groove until all the copper layers at the bottom of the stepped groove are exposed to form a stepped groove to avoid The error in the distance between the two side walls of the stepped groove is avoided; finally, the outer surface and the bottom of the stepped groove are partially copper-reduced to form the inner and outer graphics of the groove. The above manufacturing method improves the fabrication precision of the stepped groove while demetallizing one of the side walls of the stepped groove.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a manufacturing method of a stepped groove and a circuit board. Background technique [0002] With the multi-functionalization of electronic products, people have higher and higher requirements for circuit boards. Among them, circuit boards with stepped grooves can improve the overall performance of products, so they are widely used. [0003] The existing manufacturing method of the stepped groove is as follows: opening a stepped groove on a circuit board, then plating copper on the groove bottom or each surface of the stepped groove, and finally reducing copper locally on the non-metallized area to form the final groove bottom of the stepped groove. graphics. However, the vertical sidewalls of the stepped groove obtained by the above manufacturing method are all plated with copper or not plated with copper, which makes the connection between the cir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40H05K3/02H05K1/02
CPCH05K3/0044H05K3/0026H05K3/40H05K3/02H05K1/0298
Inventor 焦其正纪成光王洪府孙改霞杜红兵
Owner DONGGUAN SHENGYI ELECTRONICS
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