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Graphene chip processing and screening method

A screening method, graphene technology, applied in the field of graphene chip processing and screening, can solve the problems of graphene chip loss, graphene chip crushing, etc., to avoid loss, ensure detection results, and provide screening effects

Active Publication Date: 2021-09-24
山东中亿烯创新材料科技有限公司
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  • Application Information

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Problems solved by technology

But this detection method is to ensure that the graphene chip can be fixed in the slot, so when setting, the slot is provided with a press plate, so that the graphene chip is squeezed in the slot, but this stability prevents the graphene chip from being fixed in the slot When disassembling the graphene chip, it is necessary to manually disassemble the graphene chip, and the graphene chip is easily crushed by external force during the installation process, or the pins of the chip are bent during the disassembly process, so that the qualified of graphene chips lose during screening

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  • Graphene chip processing and screening method

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Embodiment Construction

[0039] Attached below Figure 1-7 The present invention is further described with embodiment:

[0040] A method for processing and screening graphene chips, comprising the steps of:

[0041]Step 1: Insert the graphene chip into the position of the graphene chip on the screening device according to the current level;

[0042] Step 2: Obtain the comprehensive stress data of the corresponding position of the graphene chip, the comprehensive stress data includes electrical stress data, thermal stress data and pressure stress data;

[0043] Step 3: Obtain the comprehensive limit data of each graphene chip in the plurality of candidate graphene chips, the comprehensive limit data includes electrical limit data, thermal limit data and pressure limit data;

[0044] Step 4: a plurality of target graphene chips are randomly matched with a plurality of graphene chip positions, and the target graphene chip is one of multiple candidate graphene chips whose comprehensive limit data is gre...

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Abstract

The invention relates to a graphene chip processing and screening method. The graphene chip processing and screening method comprises the following steps that step1, graphene chips are inserted into graphene chip positions on screening equipment according to current grades; and step2, comprehensive stress data of the corresponding positions of the graphene chips are obtained, and the comprehensive stress data comprise electrical stress data, thermal stress data and pressure stress data. According to the graphene chip processing and screening method, existing screening equipment is improved, the improved screening equipment optimizes graphene chip slots, and the aperture of the optimized graphene chip slots is larger than that of graphene chip bodies, so that the graphene chips can be conveniently operated when being mounted and dismounted; and the graphene chip bodies do not need to be subjected to excessive insertion and extraction force increase, in this way, the graphene chip bodies can be effectively prevented from being damaged, so that unnecessary loss of the graphene chip bodies during screening is avoided.

Description

technical field [0001] The invention relates to the technical field of graphene chip processing, in particular to a graphene chip processing and screening method. Background technique [0002] When screening the yield rate of the produced graphene chips, it is necessary to manually install the graphene chips on the chip screening machine to detect whether the chips are qualified, so as to screen out qualified graphene chip finished products. But this detection method is to ensure that the graphene chip can be fixed in the slot, so when setting, the slot is provided with a press plate, so that the graphene chip is squeezed in the slot, but this stability prevents the graphene chip from being fixed in the slot When disassembling the graphene chip, it is necessary to manually disassemble the graphene chip, and the graphene chip is easily crushed by external force during the installation process, or the pins of the chip are bent during the disassembly process, so that the qualif...

Claims

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Application Information

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IPC IPC(8): B07C5/02B07C5/34
CPCB07C5/02B07C5/34
Inventor 闫子豪
Owner 山东中亿烯创新材料科技有限公司