Solvent adhesive, bonding structure and electronic equipment

A bonding structure and solvent technology, applied in the direction of structural parts, circuits, adhesives, etc., can solve the problems of easy-to-pull glue or easy-to-tear sticker failure, increase the difficulty of battery disassembly, tear off the easy-to-pull glue, etc., to improve impact resistance As well as the effect of shear strength, improved disassembly efficiency, and improved performance

Pending Publication Date: 2021-09-28
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the easy-to-pull glue or easy-to-tear sticker is manually disassembled, it is easy to tear the easy-to-pull glue or easy-to-tear sticker, which leads to the failure of the easy-to-pull glue or easy-to-tear sticker, which increases the difficulty of battery disassembly

Method used

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  • Solvent adhesive, bonding structure and electronic equipment
  • Solvent adhesive, bonding structure and electronic equipment
  • Solvent adhesive, bonding structure and electronic equipment

Examples

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Embodiment Construction

[0026] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0027] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0028] Solvent glue is sticky and can be used to bond two objects to be bonded together so that the two are fixed. Solvent glue is disassembled by a suitable solvent to separate the two objects to be bonded. The electronic equipment includes a battery and a casing, the casing is provided with a b...

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Abstract

The invention discloses a solvent adhesive, a bonding structure and electronic equipment. The solvent adhesive comprises a bonding agent and first gap expanding particles dispersed in the bonding agent. According to the solvent adhesive, the bonding structure and the electronic equipment, the first gap expanding particles are added into the bonding agent, and the first gap expanding particles can increase molecular gaps of the bonding agent so that on one hand, the solvent can rapidly permeate into the solvent adhesive when the solvent adhesive is disassembled through the solvent; the disassembly time of the solvent adhesive is shortened, the disassembly difficulty of the battery is reduced, the disassembly efficiency of the battery is improved, on the other hand, the impact resistance and shear strength of the solvent adhesive can be improved, and the use performance of the solvent adhesive is further improved.

Description

technical field [0001] The present invention generally relates to the technical field of electronic equipment, specifically relates to the technical field of bonding, and especially relates to solvent glue, bonding structure and electronic equipment. Background technique [0002] As a commonly used mobile communication device, a mobile phone has become an essential product in people's lives because of its advantages such as convenient portability and complete functions. The mobile phone includes a casing and a battery, and the battery is installed in the casing. The battery and the casing are generally fixedly connected by easy-to-pull glue or easy-to-tear stickers to avoid shaking or separation between the two. When the mobile phone is repaired or the battery is replaced in the later stage, the battery needs to be disassembled from the casing. Among them, the battery is disassembled by manual disassembly of easy-to-pull glue or easy-to-tear stickers. [0003] However, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J11/08C09J7/25C09J7/24C09J7/21H01M50/244H01M50/247H01M50/264
CPCC09J7/30C09J11/08C09J7/255C09J7/243C09J7/21C09J2203/33C09J2467/006C09J2423/046C09J2423/106C09J2400/283
Inventor 牛海亮王宗强
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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