Packaging and plastic packaging equipment with peculiar smell removing function for integrated circuit

Abstract

The invention discloses packaging and plastic packaging equipment with a peculiar smell removing function for an integrated circuit. The technical problem of the invention is to provide the packaging and plastic packaging equipment with the peculiar smell removing function for the integrated circuit, wherein the integrated circuit can be conveniently placed and moved, and a nozzle is automatically moved downwards to spray out resin. The packaging and plastic packaging equipment with the peculiar smell removing function for the integrated circuit comprises a supporting base, a frame body, a plastic door curtain and a storage assembly, wherein a workbench is connected to the upper portion of the supporting base; the frame body is connected to the middle of the upper portion of the workbench, and a plurality of notches are symmetrically and evenly formed in one side of the frame body at intervals; the plastic door curtain is connected to one side of the frame body; and the storage assembly is arranged on the upper portion of the frame body. The packaging and plastic packaging equipment with the peculiar smell removing function for the integrated circuit has the advantages of automatically and sequentially pushing the integrated circuit to move and spray resin, automatically unlocking a placement plate and the integrated circuit, automatically removing the sprayed resin, conveniently adjusting the position of a stop lever and ensuring that a plastic door is not rolled up.

Description

technical field [0001] The invention relates to a plastic encapsulation device, in particular to an integrated circuit encapsulation plastic encapsulation device with a deodorizing function. Background technique [0002] An integrated circuit is a miniature electronic device or component. Components such as transistors and resistors and wiring are interconnected through a process, fabricated on a small semiconductor wafer or a dielectric substrate, and finally packaged in a tube shell. The packaging process of an integrated circuit is generally It is to spray resin on the integrated circuit, and then perform thermal processing to complete the plastic packaging. [0003] The existing integrated circuit packaging and plastic packaging technology generally relies on the human hand to push the integrated circuit to move in sequence, and at the same time spray the resin on the integrated circuit through the nozzle, and finally remove the integrated circuit and complete the packag...

AI Technical Summary

Problems solved by technology

[0003] The existing integrated circuit packaging and plastic sealing technology generally relies on human hands to push the integrated circuits to move sequentially, and at the same time spray the resin on the integrated circuits through the nozzle, and finally remove the integrated circuits, and complete the packaging after thermal processing. However, this operation requires first Continuously pushing the integrated circuit by hand is labor-intensive and inefficient. Secondly, when the resin is sprayed out, a large amount of peculiar smell is emitted, which is discharged to the outside world, causing pollution. Finally, the peculiar smell will be quickly emitted to the outside world because it is not covered, which is difficult to deal with

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