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Heat dissipation mechanism, gateway and light gateway

A heat dissipation mechanism and light network technology, applied in network connection, cooling/ventilation/heating transformation, short-distance communication services, etc., can solve problems such as adverse effects of power supply, temperature rise in the housing, and heat residue

Inactive Publication Date: 2021-09-28
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heat remains in the housing of the gateway or light gateway, causing the temperature inside the housing to rise
[0003] So far, there is a way to use the exhaust fan to discharge the residual heat in the casing, but the use of the exhaust fan will increase the power consumption of the product
In addition, there is also a method of simply setting mesh-shaped holes on the side of the casing to discharge heat, but dust and other sundries easily enter the inner cavity of the casing through the mesh-shaped holes, which may cause damage to the internal cavity of the casing. components and power supply, etc. will cause adverse effects

Method used

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  • Heat dissipation mechanism, gateway and light gateway
  • Heat dissipation mechanism, gateway and light gateway
  • Heat dissipation mechanism, gateway and light gateway

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] figure 1 A schematic structural diagram of a casing of an electronic product having the heat dissipation mechanism 21 in Embodiment 1 of the present invention is shown. figure 2 show figure 1 A schematic diagram of the inner cavity structure of the housing 2 in . Such as figure 1 As shown, the housing of the electronic product includes a housing 2 and a cover 1 that is engaged and connected with the housing 2 . refer to figure 2 and Figure 5 , the heat dissipation mechanism 21 of the embodiment of the present invention is disposed on three side walls of the casing 2, and the heat dissipation mechanism 21 includes one or more heat dissipation parts. Of course, the heat dissipation mechanism 21 can also be provided only on one or two side walls of the housing 2, and the number of heat dissipation parts included in the heat dissipation mechanism 21 can also be flexibly set according to actual needs, which is not limited in the present invention.

[0063] Refer bel...

Embodiment 2

[0081] In traditional designs, BLE communication is peer-to-peer. BLE tags or sensor nodes communicate directly with the gateway. Such as Figure 10 As shown, the tags communicate with the cloud server through two gateways respectively. With this communication method, due to the hardware limitation of BLE technology, the message cannot be transmitted over a long distance, so the gateway must be deployed very close to the BLE tag to receive the BLE message sent by the BLE tag. In addition, due to the high cost of the wind gateway and the high deployment density of the gateway, the deployment cost of the entire network is high.

[0082] In order to solve the above-mentioned technical problems existing in the prior art, an embodiment of the present invention provides a bluetooth low power consumption mesh network capable of long-distance message transmission and low deployment cost.

[0083] The Bluetooth low energy mesh network in this embodiment has multiple subnets. Each s...

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Abstract

The invention discloses a heat dissipation mechanism, a gateway and a light gateway. The heat dissipation mechanism is arranged on a shell and is provided with a heat dissipation part. The heat dissipation part is provided with a heat dissipation slit which is formed in the side wall of the shell and communicates with the inner cavity of the shell; and a blocking mechanism which is formed such that the inner cavity of the shell is blocked by the blocking mechanism to be invisible when observed through the heat dissipation slit in the direction perpendicular to the side wall. According to the structure, the blocking mechanism can effectively prevent dust and other impurities from entering the shell, and therefore the service life of parts contained in the inner cavity of the shell and the service life of a power source can be prolonged.

Description

technical field [0001] The invention relates to the communication field, in particular to a heat dissipation mechanism, and also to a gateway and a light gateway equipped with the heat dissipation mechanism. Background technique [0002] In the process of using a gateway or a light gateway, it is necessary to transmit radio waves, and heat is generated due to the use of electricity in the process of transmitting radio waves. This heat remains in the housing of the gateway or the light gateway, causing the temperature inside the housing to rise. [0003] In the past, there was a way to use the exhaust fan to discharge the residual heat in the casing, but the use of the exhaust fan would increase the power consumption of the product. In addition, there is also a method of simply setting mesh-shaped holes on the side of the casing to discharge heat, but dust and other sundries easily enter the inner cavity of the casing through the mesh-shaped holes, which may cause damage to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L12/66H04W88/16H04Q1/02H05K7/20H04W4/80H04W4/06H04W4/02H04W64/00
CPCH04L12/66H04W88/16H04Q1/035H04Q1/02H04Q1/11H04W4/80H04W4/06H04W4/023H04W64/006
Inventor 唐志文胡新振陈可彭彬孙崑泉
Owner TDK CORPARATION