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Manufacturing method of high-voltage-resistant metal-based circuit board suitable for a plug-in mode and circuit board

A technology of metal-based circuit boards and manufacturing methods, applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc.

Active Publication Date: 2021-10-01
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a metal-based circuit board manufacturing method and circuit board suitable for plug-in high-voltage resistance, aiming to solve the problem that the metal-based circuit board cannot use the plug-in method to connect components and metal-based circuit boards

Method used

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  • Manufacturing method of high-voltage-resistant metal-based circuit board suitable for a plug-in mode and circuit board
  • Manufacturing method of high-voltage-resistant metal-based circuit board suitable for a plug-in mode and circuit board

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.

[0047] It should also be understood that the terminology used ...

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Abstract

The embodiment of the invention discloses a manufacturing method of a high-voltage-resistant metal-based circuit board suitable for a plug-in mode and a circuit board. The manufacturing method comprises the steps of preparing an aluminum substrate, and drilling a resin hole and a riveting hole; filling the resin hole and the riveting hole with heat-conducting resin; pressing a first high heat conduction medium layer on the aluminum substrate; falsely pasting a second high-heat-conduction medium layer; drilling the aluminum substrate again so as to penetrate through the resin hole and the riveting hole; preparing a double-sided substrate with a PTH hole; filling the etching area of the inner layer circuit of the double-sided substrate and the PTH hole with heat-conducting resin; pre-stacking the aluminum substrate and the double-sided substrate, and riveting the aluminum substrate and the double-sided substrate; subjecting the aluminum substrate and the double-sided substrate which are riveted to lamination treatment; and drilling the aluminum substrate and the double-sided substrate which are subjected to lamination treatment so as to penetrate through the PTH hole of the double-sided substrate. According to the embodiment of the invention, the heat-conducting resin is packed in the resin hole, the resin hole and the PTH hole are re-drilled again, and the PTH hole is exposed, so that the problem that the single-sided multi-layer metal-based circuit board cannot use a plug-in mode is solved.

Description

technical field [0001] The invention relates to the field of circuit board production technology, in particular to a method for manufacturing a high-voltage-resistant metal-based circuit board in a plug-in mode and the circuit board. Background technique [0002] At present, there are product design requirements, the double-sided substrate needs to be pressed together with the aluminum substrate, and the thermal conductivity is required to be greater than 8W / m.k, the DC withstand voltage of the dielectric layer is greater than 5000V, and the plug-in method on the PTH needs to be used; but the current production method And materials, the thermal conductivity is lower than 4W / m.k, and the single-sided double-layer (multi-layer) aluminum-based circuit board, the wall of the hole after drilling is made of metal aluminum, if you use components with pins, it will inevitably cause a short circuit of the components, resulting in The device mounting method is limited, and the convent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46H05K3/00
CPCH05K3/429H05K3/0047H05K3/0094H05K3/4614
Inventor 张飞龙肖安云李秋梅
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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