Refrigerant medium and system for immersion phase change cooling of electronic equipment

A phase-change cooling and refrigerant technology, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of equipment short circuit, combustion explosion, and electrical insulation decline, and achieve improved heat dissipation efficiency, Effects of energy saving and low dielectric constant

Pending Publication Date: 2021-10-01
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since water is easy to introduce impurity ions to reduce electrical insulation, it is easy to cause short circuit of equipment
Mineral oil has high electrical insulation performance, but mineral oil is flammable, once the equipment generates electric sparks or has external fire sources, static electricity, etc., it is easy to burn and explode

Method used

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  • Refrigerant medium and system for immersion phase change cooling of electronic equipment
  • Refrigerant medium and system for immersion phase change cooling of electronic equipment
  • Refrigerant medium and system for immersion phase change cooling of electronic equipment

Examples

Experimental program
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Effect test

Embodiment approach

[0034]In an optional embodiment of the present invention, the refrigerant medium is perfluoro-2-methyl-2,3-epoxypentane, perfluoro-4-methyl-2-pentene, perfluorohexanone , perfluorohexane, perfluoropentane, one, two, three or any combination of components.

[0035] Optionally, when the cold medium is a mixture of two or more components, the mass proportion of each component is 4-70%, calculated by taking the total mass of the composition as 100%.

[0036] Compared with the prior art, the beneficial effects of the embodiments of the present invention are reflected in:

[0037] 1) The refrigerant medium provided by the embodiments of the present invention has high electrical insulation performance, low viscosity, low boiling point, low dielectric constant (low polarity), high thermal conductivity, high latent heat of vaporization, good compatibility and stability , non-flammable and inhibited combustion, low global warming potential (GWP), zero ozone depletion potential (ODP) an...

Embodiment 1

[0049] Place the desktop computer host in a closed liquid cooling device. The liquid cooling device is equipped with cooling liquid and heat exchange pipe network. The heat exchange pipe network is suspended above the cooling liquid. All accessories of the main computer are immersed in the cooling liquid. Use perfluoro-4-methyl-2-pentene as cooling liquid. The CPU generates heat during operation, and the gas formed by the vaporization of the coolant when it encounters heat is cooled down when it flows upwards and touches the heat exchange pipe network (the heat exchange pipe network is passed into ordinary tap water for cooling). Computer host external display. The temperature of the CPU and GPU is detected through the CPU-Z program, and the body is equipped with a digital display thermometer to display the temperature of the coolant. When the CPU and GPU are running at full load, the computer runs smoothly for 24 hours, the CPU temperature is 51°C, the GPU temperature is 62°...

Embodiment 2

[0053] Using the same computer configuration as in Example 1, place the mainframe of the desktop computer in a closed liquid cooling device. The liquid cooling device is equipped with a cooling liquid and a heat exchange pipe network, and the heat exchange pipe network is suspended above the cooling liquid. All accessories of the main computer Submerged in coolant. Perfluorohexanone is used as the cooling liquid. The CPU generates heat during operation, and the gas formed by the vaporization of the coolant when it encounters heat is cooled down when it flows upwards and touches the heat exchange pipe network (the heat exchange pipe network is passed into ordinary tap water for cooling). Computer host external display. The temperature of the CPU and GPU is detected through the CPU-Z program, and the body is equipped with a digital display thermometer to display the temperature of the coolant. When the CPU and GPU are running at full load, the computer runs smoothly for 24 hou...

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Abstract

The invention provides a refrigerant medium and a system for immersion phase change cooling of electronic equipment. The refrigerant medium is one selected from a group consisting of perfluoro-2-methyl-2,3-epoxypentane, perfluoro-4-methyl-2-pentene, perfluorohexanone, perfluorohexane and perfluoropentane, or a mixture of two or any components of perfluoro-2-methyl-2, 3-epoxypentane, perfluoro-4-methyl-2-pentene, perfluorohexane and perfluoropentane. The immersion phase change refrigerant medium provided by the invention has the characteristics of high electrical insulation property, low viscosity, low boiling point, high latent heat of vaporization, good compatibility and stability, incombustibility, capability of inhibiting combustion, low global warming potential (GWP), zero ozone consumption potential (ODP) and the like. Meanwhile, the refrigerant medium can improve the latent heat of vaporization of the refrigerant medium, so the system power of the cooling system using the refrigerant medium is remarkably reduced, the cooling system using the refrigerant medium is indirectly made to be compact in structure, and the service life of the system is prolonged.

Description

technical field [0001] The invention relates to the field of liquid cold medium, in particular to a cold medium and a system for immersing phase change cooling electronic equipment. Background technique [0002] In the era of digital economy, with the rapid development of artificial intelligence, cloud computing, blockchain, big data technology, and supercomputers, the amount of computing data is increasing exponentially. The data center that undertakes these data calculations and storage has also shown a development trend of high density and high power. Such rapid development has brought about a serious problem, that is, the heat dissipation of electronic equipment. The traditional air-cooled heat dissipation technology can no longer fully meet the heat dissipation requirements of electronic equipment, and there are problems of high noise and high energy consumption, which restrict the further development of data centers. . [0003] With the advancement of science and tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/208H05K7/20836
Inventor 张鹏彭晶楠崔新涛刘浩鹏崔瑞男刘佳伟
Owner SUGON DATAENERGYBEIJING CO LTD
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