Filling path generation method based on skeleton line

A path generation and skeleton line technology, applied in the field of filling paths, can solve problems such as reducing processing efficiency and adverse printing quality, and achieve the effect of good versatility and simple algorithm

Active Publication Date: 2021-10-15
HENAN UNIV OF SCI & TECH
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The two commonly used path planning methods are the parallel reciprocating method and the offset contour offset method. These two algorithms have been widely used, but there will be some unavoidable problems in the face of different applications.
[0003]In extrusion-type additive manufacturing, t

Method used

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  • Filling path generation method based on skeleton line
  • Filling path generation method based on skeleton line
  • Filling path generation method based on skeleton line

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Embodiment Construction

[0053] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0054] figure 1 Shown is a flow chart of the method for generating an internal filling path in the present invention. to attach figure 2 Take the two-dimensional offset contour in as an example to illustrate the method of generating the internal filling path. The size of the figure is 84.5mm*137.5mm, with the attached figure 2 , image 3 Take the two-dimensional offset contour in as an example to illustrate the internal filling path generation method. The size of the figure is 137.5mm*137.5mm.

[0055] A method for generating a filling path based on skeleton lines, comprising the following steps:

[0056] Step 1: Offset the input two-dimensional offset contour set accor...

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Abstract

The invention provides a filling path generation method based on a skeleton line, which comprises the following steps: step 1, biasing an input two-dimensional contour set according to a set path spacing to obtain a biased contour; step 2, generating a connected region set by using the offset contour set; step 3, obtaining a skeleton line of each connected region; step 4, segmenting a single connected region according to the skeleton line to obtain a plurality of sub-regions; step 5, generating sub-filling paths in each sub-region according to the set path spacing; and step 6, connecting the sub-filling paths to obtain a filling path of the whole connected region. According to the method, the problem that more empty paths exist in a conventional common path filling method can be avoided, and a solution is provided for path planning with special process requirements. The method is suitable for areas of various shapes, has the advantages of being simple in algorithm and good in universality, and has a certain promotion effect on development and popularization of the filling path in multiple fields.

Description

technical field [0001] The invention belongs to the technical field of filling paths, in particular to a method for generating filling paths based on skeleton lines. Background technique [0002] The filling path planning method is one of the key technologies in several fields such as machine tool cutting and additive manufacturing. In path planning, we should not only consider some common issues, such as improving processing efficiency and reducing processing errors, but also fully consider the particularity of manufacturing processes, such as reducing empty paths and reducing the number of effective paths. Two commonly used path planning methods are the parallel reciprocating method and the offset contour offset method. These two algorithms have been widely used, but there will be some unavoidable problems in the face of different applications. [0003] In extrusion-type additive manufacturing, the empty path will not only reduce the processing efficiency, but also requir...

Claims

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Application Information

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IPC IPC(8): B29C67/00
CPCB29C67/00Y02T90/00
Inventor 朱俊杰金育安傅李达
Owner HENAN UNIV OF SCI & TECH
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