Film tearing device for printed circuit boards

A technology for printed circuit boards and film devices, applied in printed circuits, printed circuit manufacturing, packaging, etc., can solve the problems of poor consistency of manual tearing films and difficulty in ensuring the quality of tearing films, achieve good tearing film consistency, improve tearing film Efficiency, the effect of ensuring the quality of the tear film

Active Publication Date: 2021-12-10
深圳双十科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a film tearing device for printed circuit boards to solve the technical problems in the prior art that the consistency of artificial film tearing is poor and it is difficult to ensure the quality of the film tearing

Method used

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  • Film tearing device for printed circuit boards
  • Film tearing device for printed circuit boards
  • Film tearing device for printed circuit boards

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Embodiment Construction

[0062] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as being "fixed" / "installed" on another element, it may be directly on the other element, or there may be one or more intervening elements therebetween. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "vertical", "horizontal" etc. used in this specification is based on the orientation or positional relationship shown in the drawings, It is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or elem...

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Abstract

The embodiment of the invention relates to the technical field of printed circuit boards, and discloses a film tearing device for printed circuit boards, including a conveying mechanism, an adsorption table and a film tearing mechanism. The conveying mechanism includes a conveying track, and the conveying track is used for conveying the film to be torn, and the film is attached to the side of the film to be torn facing the conveying track. The adsorption table and the conveying track are all located on the same side of the film to be torn off, the adsorption table includes an adsorption surface, the adsorption surface faces away from the plane where the film to be torn off, and the adsorption surface is used to absorb the film torn off from the film to be torn off. The film tearing mechanism includes film tearing claws and claw driving components. The tearing film claws are used to clamp the film. The claw driving components are connected to the film tearing claws. The claw driving components are used to drive the film tearing claws to pick up the film and drive the film tearing claws to absorb surface movement, the tearing claws drive the film to be torn off from the film to be torn off, and the torn film is absorbed by the adsorption surface. Through the above settings, the tearing film can be completed by the film tearing device, and the film tearing consistency is good, which ensures the quality of the film tearing.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a film tearing device for printed circuit boards. Background technique [0002] In the semiconductor packaging process, the printed circuit board generally needs to be pasted with a film before assembly, and the film needs to be torn off in the final packaging process. [0003] At present, tearing off the film of the printed circuit board is done manually. Because the adsorption between the printed circuit board and the film is not easy to separate, the consistency of the manual tearing film is poor, and it is difficult to guarantee the quality of the tearing film. Contents of the invention [0004] The invention provides a film tearing device for printed circuit boards to solve the technical problems in the prior art that the consistency of artificial film tearing is poor and it is difficult to ensure the quality of the film tearing. [0005] In order to solve ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B69/00B65G47/82B65G47/74B65G47/90B65G23/04B65G15/12B65G23/44B65G47/22H05K3/00
CPCB65B69/00B65G47/82B65G47/74B65G47/90B65G23/04B65G15/12B65G15/105B65G23/44B65G47/22H05K3/00B65G2201/022
Inventor 王仕初王佐珍张斌
Owner 深圳双十科技股份有限公司
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