a probe card
A technology of probe cards and probes, applied in the field of probe cards, which can solve problems such as easy slipping of pins, affecting yield, testing problems, etc., and achieves the effect of good wafer testing ability and increased manufacturing cost
Active Publication Date: 2022-07-19
SEMICON MFG INT TIANJIN +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] Aiming at the problem that the current conventional probe card is still easy to slip during wafer testing, causing testing problems and affecting the yield rate, this application provides a probe card that can avoid slipping pins and ensure that the probes and pads are good contact and deep insertion depth
Method used
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[0023] The following description provides specific application scenarios and requirements of the present application, and is intended to enable those skilled in the art to make and use the contents of the present application. Various partial modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments and without departing from the spirit and scope of the present application. application. Therefore, the present application is not to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.
[0024] The technical solutions of the present invention will be described in detail below with reference to the embodiments and the accompanying drawings.
[0025] figure 1 It is a schematic diagram of the structure of a cantilever probe card and a schematic diagram of its needle marks.
[0026] refer to figure 1 shown, where, ...
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Abstract
The present application provides a probe card, the probe card includes: a substrate; and a plurality of probes, the plurality of probes are respectively electrically connected to the substrate, wherein each probe of the plurality of probes The projections of the needles on the substrate all fall on the same straight line. In the probe card described in the present application, the projections of each probe of the plurality of probes on the substrate all fall on the same straight line, and the probes contact the pads in the direction of the cutting track and will not slide out of the solder pads. The pads, probes and pads have good contact, the depth of the needle is deep, and the wafer testing capability is better, and compared with the conventional probe card, it only needs to simply adjust the arrangement of the probes, no major modification, no Increase the cost of the probe card.
Description
technical field [0001] The present application relates to the field of integrated circuit devices, and in particular, to a probe card. Background technique [0002] The process of semiconductor manufacturing generally includes integrated circuit design, wafer manufacturing, wafer testing, etc. Among them, wafer testing is particularly important for cost control of chips. In wafer testing, a probe card with a plurality of probes is usually used, and the probes of the probe card are electrically connected to the chips on the wafer for electrical testing. Specifically, test pads are provided on the cutting track of the wafer, and the probes and the pads need to be in contact with each other to complete the electrical test. [0003] However, the conventional probe card is still prone to needle slippage during wafer testing, causing testing problems and affecting yield. Therefore, there is a need to provide more reliable or efficient probe cards. SUMMARY OF THE INVENTION ...
Claims
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IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2886G01R1/07321
Inventor 牛刚
Owner SEMICON MFG INT TIANJIN