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Probe card

A probe card and probe technology, applied in the field of probe cards, can solve the problems affecting yield, easy needle slippage, testing problems, etc., and achieve the effect of increasing the cost and improving the wafer testing ability.

Active Publication Date: 2021-10-22
SEMICON MFG INT TIANJIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the current conventional probe card is still easy to slip during wafer testing, causing testing problems and affecting the yield rate, this application provides a probe card that can avoid slipping pins and ensure that the probes and pads are good contact and deep insertion depth

Method used

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Embodiment Construction

[0023] The following description provides specific application scenarios and requirements of the application, with the purpose of enabling those skilled in the art to manufacture and use the contents of the application. Various local modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and embodiments without departing from the spirit and scope of the application. application. Thus, the application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

[0024] The technical solution of the present invention will be described in detail below in conjunction with the embodiments and the accompanying drawings.

[0025] figure 1 It is a schematic structural diagram of a cantilever probe card and a schematic diagram of needle marks.

[0026] refer to figure 1 As shown, among them, figure 1 (a) is a sectio...

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Abstract

The invention provides a probe card. The probe card comprises a substrate, and a plurality of probes which are electrically connected with the substrate, and the projection of each probe of the plurality of probes on the substrate is located on the same straight line. According to the probe card provided by the invention, the projection of each of the plurality of probes on the substrate is on the same straight line, the probes are in contact with a welding pad along the direction of a cutting channel and do not slide out of the welding pad, the probes are in good contact with the welding pad, the probe inserting depth is relatively large, and the wafer testing capability is relatively good; compared with a conventional probe card, only the arrangement mode of the probes needs to be simply adjusted, no large transformation is needed, and the manufacturing cost of the probe card is not increased.

Description

technical field [0001] The present application relates to the field of integrated circuit devices, in particular to a probe card. Background technique [0002] The process of semiconductor manufacturing generally includes integrated circuit design, wafer manufacturing, wafer testing, etc. Among them, wafer testing is particularly important for chip cost control. In wafer testing, a probe card with multiple probes is usually used, and the probes of the probe card are electrically connected to chips on the wafer for electrical testing. Specifically, a test pad is provided on the dicing line of the wafer, and the electrical test can only be completed if the probe and the pad need to be in contact with each other. [0003] However, the current conventional probe card still has the problem of easy pin slippage during wafer testing, causing testing problems and affecting yield. Therefore, there is a need to provide more reliable or efficient probe cards. Contents of the inven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2886G01R1/07321
Inventor 牛刚
Owner SEMICON MFG INT TIANJIN