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[0032] First, see Figure 1A ~ Figure 1M As shown, a preferred embodiment of a flip-chip electro-excited photonic crystal surface-emitting laser (Electrically Pumped Photonic-Crystal Surface-Emitting Lasers) element 10 of the present invention includes: a first substrate (substrate) 11A, which has A first surface 111 and a second surface 112 on the opposite side. In this embodiment, the material of the first substrate 11A may include gallium nitride (GaN), gallium arsenide (GaAs), indium phosphide (InP ), gallium antimonide (GaSb), but not limited thereto.
[0033]A first cladding layer (cladding layer) 12 is located on the first surface 111 of the first substrate 11A. In this embodiment, the material of the first cladding layer 12 may include aluminum gallium arsenide (AlGaAs ), gallium arsenide (GaAs), aluminum gallium nitride (AlGaN), aluminum gallium indium arsenide (AlGaInAs), aluminum gallium indium phosphide (AlGaInP), aluminum gallium antimonide (AlGaSb), gallium arse...
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Abstract
The invention discloses a flip-chip type electro-excitation photonic crystal surface emitting type laser element. An epitaxial structure of the flip-chip type electro-excitation photonic crystal surface emitting type laser element is provided with a high platform, wherein the high platform is provided with a plurality of air holes to form a photonic crystal structure, the epitaxial structure is also provided with a concave platform, and the facing direction of the concave platform is the same as the facing direction of the photonic crystal structure; a first electrode metal, which is positioned on an insulating layer and covers the photonic crystal structure; and a second electrode metal, which is positioned on the concave platform and protrudes out of the concave platform, so that the facing direction of the first electrode metal and the facing direction of the second electrode metal are the same, and then the first electrode metal is jointed to a first jointing metal and the second electrode metal is jointed to a second jointing metal, so that the photonic crystal structure is flip-chip.
Description
technical field [0001] The invention relates to a flip-chip electro-excited photonic crystal surface-emitting laser element, the first electrode metal and the second electrode metal face the same surface, the first electrode metal can be bonded to the first bonding metal and the second electrode metal can be bonded The second bonding metal makes the photonic crystal structure flip-chip. Background technique [0002] U.S. Patent US10340659B1 discloses an electro-excited photonic crystal surface-emitting laser element, which includes: a substrate with a first surface and a second surface on the opposite side; a first cladding layer located on the first surface of the substrate On the surface; an active layer, located on the first cladding layer, and has a quantum structure; a second cladding layer, located on the active layer; a contact layer, located on the second cladding layer, and with The second cladding layer and the contact layer are in a plateau shape and are provided...
Claims
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