Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A selection test device for research and development of semiconductor device materials

A technology for selecting test and device materials, applied in the direction of measuring devices, measuring device casings, components of electrical measuring instruments, etc., can solve the problems of elastic and anti-loosening of fixed bolts, easy loosening of fixed bolts, and inconvenient disassembly and assembly.

Active Publication Date: 2021-11-30
南通优睿半导体有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the above-mentioned technical problems, the present invention provides a selective testing device for the research and development of semiconductor device materials to solve the existing one. Although the existing device can realize the test of the conductive state of the semiconductor material through the contact between the semiconductor material and the test circuit, the structure It is too single, and it is impossible to automatically realize multiple cleaning of the indicator light and wipe cleaning of the contact piece through structural improvement in the process of realizing the semiconductor conductivity test; moreover, most of the contact pieces of the existing devices are fixed on the main body by bolts On the board, disassembly is not convenient enough, and it cannot be combined with the fixing of the main board through structural improvement; finally, the fixing bolts of the main board of the existing device are easy to loose, and the fixing cannot be realized through structural improvement The problem of elastic anti-loosening of bolts

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A selection test device for research and development of semiconductor device materials
  • A selection test device for research and development of semiconductor device materials
  • A selection test device for research and development of semiconductor device materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0045] as attached figure 1 to attach Figure 9 Shown:

[0046] The invention provides a selective testing device for the research and development of semiconductor device materials, which includes a main body plate 1; the main body plate 1 is fixed on a workbench, and a mounting seat 2 is installed on the main body plate 1, and a blank 5 is placed on the mounting seat 2; the main body An auxiliary part 3 is installed on the board 1, and a test part 4 is installed on the auxiliary part 3; the auxiliary part 3 includes: a seat body 301, which is fixedly connected to the main body plate 1 by bolts, and two symmetrical openings are arranged on the seat body 301. Bar sliding groove 302, and two sliding grooves 302 are T-shaped groove-shaped structures; Sliding block 303, sliding block 303 is rectangular block structure, and sliding block 303 contacts with blank 5, and two Protrusion 304; two protrusions 304 are slidingly connected with two sliding grooves 302, and the sliding blo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a selection test device for the research and development of semiconductor device materials, which relates to the field of semiconductor test technology, and solves the problem that although the test of the conductive state of the semiconductor material can be realized through the contact between the semiconductor material and the test circuit, the structure is too simple to pass the structural test. In the process of realizing the semiconductor conductivity test, the problem of automatically realizing multiple cleaning of the indicator light and wiping cleaning of the contact piece. A selection test device for research and development of semiconductor device materials, comprising a main board; the main board is fixed on a workbench, and an installation seat is installed on the main board, and a blank is placed on the installation seat. Because there are two card slots in total, and the two card slots are set on two support plates respectively; the two card slots are rectangular slot-shaped structures, and a mounting seat is inserted in the two card slots, and when After the fixing bolts are tightened, the mounting seat is clamped and fixed, so that there is no need to use bolts alone to fix the mounting seat.

Description

technical field [0001] The invention belongs to the technical field of semiconductor testing, and more specifically relates to a selection testing device for research and development of semiconductor device materials. Background technique [0002] In the process of research and development of semiconductor materials, it is necessary to conduct electrical tests on multiple semiconductor materials to test their electrical conductivity. [0003] Such as the application number: CN201410606182.7, a semiconductor test fixture, including: a base; a number of test pins located on the base, each test pin includes a first test pin, the first test pin includes a first body, located on the second A first test terminal at one end of the body and a first connection terminal at the other end of the first body; an insulator covering the surface of the first body of the first test pin; a second test terminal on the surface of the insulator surrounding the first test pin The second test need...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/02G01R1/04B08B1/04B08B1/00B08B5/02B08B13/00
CPCG01R1/02G01R1/04B08B5/02B08B13/00B08B1/143B08B1/32
Inventor 许海渐王海荣王磊
Owner 南通优睿半导体有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products