MCM packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, and electric-solid-state devices, etc., can solve problems such as affecting product performance and restricting product miniaturization.
Active Publication Date: 2021-11-05
SIPLP MICROELECTRONICS CHONGQING CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product
Method used
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[0093] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0094] figure 1 is a schematic cross-sectional structure diagram of the MCM package structure of the first embodiment of the present invention.
[0095] refer to figure 1 As shown, the MCM package structure 1 includes:
[0096] The first die 11 includes a plurality of first pads 111, the first pads 111 are located on the active surface 11a of the first die 11; the first die 11 is provided with a receiving groove 110, and the opening of the receiving groove 110 is located the back side 11b of the sheet 11;
[0097] The second die 12 includes a plurality of second pads 121, and the second pad 121 is located on the active surface 12a of the second die 12; The die 11 is fixed, and the active surface 12a of the second die 12 faces away from...
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Abstract
The invention provides an MCM packaging structure and a manufacturing method thereof. In the MCM packaging structure, a first bare chip, a second bare chip and an electric connection structure are packaged in a plastic packaging layer, the first bare chip is provided with a containing groove, and an opening of the containing groove is located on the back face of the first bare chip; the second bare chip is arranged in the containing groove and is fixed with the first bare chip through heat-conducting glue, and the active surface of the second bare chip is opposite to the active surface of the first bare chip; and a heat dissipation electrode is arranged on one side of the front surface of the plastic packaging layer and is connected with the heat-conducting glue. According to the MCM packaging structure and the manufacturing method thereof of the embodiment of the invention, the heat-conducting glue not only can be in contact with the bottom wall and the four side walls of the containing groove, but also can be in contact with the bottom wall and the four side walls of the second bare chip, and the contact area is large, so that the heat dissipation effects of the first bare chip and the second bare chip are improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to an MCM packaging structure and a manufacturing method thereof. Background technique [0002] In the packaging process, dies with different functions are often packaged in a package structure to form a specific function, which is called a multi-chip module (Multi-Chip Module, MCM), which has small size, high reliability, high performance and versatility. [0003] In recent years, with the continuous development of circuit integration technology, electronic products are increasingly developing in the direction of miniaturization, intelligence, high integration, high performance and high reliability. Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product. [0004] After the product is miniaturized, the heat dissipation performance is very important for the product. [0005] In view of this, the present in...
Claims
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IPC IPC(8): H01L25/065H01L23/31H01L23/48H01L23/373H01L21/56
CPCH01L25/0657H01L23/3107H01L23/48H01L23/3737H01L21/56H01L2225/06589H01L2224/32145H01L2224/2518H01L2224/04105H01L2224/73267H01L2224/24147H01L2224/96H01L2224/83005H01L24/24H01L24/82H01L24/96H01L2924/1815H01L23/3736H01L24/05H01L24/29H01L21/76224H01L23/3121H01L23/5389H01L24/19H01L24/20H01L21/568H01L2224/05005H01L2224/05023H01L2224/29006H01L2224/29026H01L2225/06524H01L2225/06555H01L2924/01029H01L2924/0665H01L2924/182H01L2924/3511
Inventor 杨威源
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD