IC card chip filling equipment capable of achieving uniform gluing

Abstract

The invention discloses IC card chip filling equipment capable of achieving uniform gluing, and belongs to the field of chip filling. The IC card chip filling equipment comprises a gluing device, a suction device and a to-be-filled plate; the gluing device comprises a supporting seat, a supporting plate, a swing mechanism and a gluing mechanism; the gluing mechanism comprises a rotating shaft, a guide wheel, a rolling ball seat, a glue dripping pipe, an adjusting plate, an adjusting block and a glue storage cavity; the suspension end of the supporting plate is connected with a rotating shaft through a bearing; the rotating shaft is sequentially provided with a motor, the adjusting plate, the glue storage cavity and the guide wheel from top to bottom; the suspension end of the adjusting plate is movably sleeved with the adjusting block; the lower end of the adjusting block is connected with the glue dripping pipe through a pin shaft; the lower end of the glue dripping pipe is provided with the rolling ball seat; and the glue storage cavity comprises an upper glue guide cavity, a lower glue guide cavity, a sealing ring, a shifting rod, a glue inlet pipe and a glue outlet pipe. Under the condition of the same glue coating amount, the filling stability of an IC card chip is improved, the accuracy of the glue coating position is guaranteed, and meanwhile the filling efficiency of the IC card chip is improved.

Description

technical field [0001] The invention relates to the field of chip filling, in particular to IC card chip filling equipment with uniform glue coating. Background technique [0002] With the development of science and technology, electronic products are becoming more and more advanced and smaller and smaller. The root of the development of electronic products lies in the extensive use of IC card chips. IC is a large number of microelectronic components (transistors, resistors, capacitors, etc.) The formed integrated circuit is placed on a plastic base to make a chip. Because the electronic chip body is extremely small, it needs to be encapsulated by epoxy ester before use, but it needs to be fixed in the IC card chip to be filled by dispensing before the encapsulation so as to use the IC card chip. The IC card chip filling process generally includes a gluing device, a suction device and a board to be filled for chip filling. After the glue is applied to a specific position on...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a uniform IC card chip filling equipment, which can effectively solve the problem that the chip from the plate to be filled due to the point-like injection mode of the glue is easy to occur during the filling process of the chip. The problem of falling and glue application position is not accurate enough

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