High-precision grinding and clamping device and method for inner hole of hemispherical bearing part

Abstract

The invention discloses a high-precision grinding and clamping device for an inner hole of a semispherical bearing part. A semispherical groove of a spherical flange is designed, and a to-be-machined semispherical bearing part is pressed by a plane flange, so that the semispherical bearing part is in spherical fit with the spherical flange; automatic alignment of the to-be-machined semispherical bearing part is achieved through the principle of automatic alignment of sphere center coincidence, high-precision and rapid clamping and automatic alignment can be achieved, the grinding efficiency of a spherical bearing and the one-time machining qualification rate of products are improved, and meanwhile the advantages of being easy to assemble and convenient to operate are achieved; and the invention further provides a high-precision grinding and clamping method for the inner hole of the semispherical bearing part, operation is easy, the requirement for the technical level of operators is low, and the application range is wide.

Description

technical field [0001] The invention belongs to the technical field of precision machining of aerospace inertial devices, and in particular relates to a high-precision grinding and clamping device and method for inner holes of hemispherical bearing parts. Background technique [0002] The hemispherical bearing part is the key component of the hemispherical dynamic pressure motor. The verticality between the inner hole and the end surface is required to be within 0.001mm, and the eccentricity between the spherical surface and the axis of the inner hole is required to be within 0.001mm. The traditional processing method is: use the end surface tooling to locate, cement the hemispherical bearing parts to the end surface tooling, fix the end surface tooling to the end surface tire with screws, correct the end surface runout and spherical surface runout of the hemisphere, and use the inner hole grinding wheel to grind the hemisphere The inner hole of the bearing part finally guar...

AI Technical Summary

Problems solved by technology

During the production process, there are the following problems: due to the cementation of the hemispherical bearing parts and the end surface tooling, the thickness of the cemented layer is uneven, and the spherical surface runout of 0.001mm is required to be aligned during processing. The tooling was removed and re-cemented; at the same time, due to the small cementing force, falling and bumping often occurred during the processing, resulting in scrapped parts; the precision of the parts was high, and the pass rate of the eccentric index between the spherical surface and the inner hole axis was low, and the index exceeded Repeated rework after poor results leads to extremely low processing efficiency

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