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Data center point of delivery layout and configurations

A data and switch technology, applied in the field of data center configuration, which can solve problems such as difficult adjustment and scaling of data centers

Pending Publication Date: 2021-11-26
BAIDU USA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to flexibly adjust and scale the cooling infrastructure of a data center to meet changing hardware configurations of separate compute and storage PoDs
The need to upgrade and refresh IT equipment and deploy new computing architectures with separated compute and storage PoDs at a rate much faster than the lifecycle of the facility housing the data center makes it challenging to realize the full potential of the new computing architecture

Method used

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  • Data center point of delivery layout and configurations
  • Data center point of delivery layout and configurations
  • Data center point of delivery layout and configurations

Examples

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Embodiment Construction

[0024] Various embodiments and aspects of the invention will be described with reference to details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of the invention and should not be construed as limiting the invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the invention.

[0025] Reference to "one embodiment" or "one embodiment" in the specification means that a particular feature, structure or characteristic described in connection with the embodiment may be included in at least one embodiment of the present invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment...

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Abstract

Disclosed are layouts, arrangements, and configurations of room airflow, server racks and cooling delivery subsystems that support data centers having system architectures with segregated compute and storage point of deliveries (PoDs). A cooling row is arranged in the rear side of racks housing a PoD to supply the PoD with the cooling delivery subsystem, which includes a recirculating loop supplying cooling fluid to the PoD and returning warm fluid to the cooling source. Modular cooling units of the cooling row includes cooling coils used to cool the airflow leaving the racks. The cooling capacity of the cooling liquid supplied to the cooling delivery subsystem for a PoD may be independently adjusted and controlled in a feedback loop based on the temperature of the air of the PoD after it has been cooled by the cooling coils, such as the outlet air temperature from the cooling row housing the PoD.

Description

technical field [0001] Embodiments of the invention generally relate to data center configurations. More specifically, embodiments of the invention relate to thermal management and facility infrastructure design and layout to support the deployment and operation of electronics racks in data centers with varying compute and storage point-of-delivery (PoD) configurations. Background technique [0002] Computing clusters and data centers serve the computing, storage and other information technology (IT) needs of today's information economy. With the rapid development of technology and continuous improvement of performance requirements, new applications and workloads such as machine learning, video streaming, high-performance computing, and new computing architectures such as the separation of computing and storage resources or PoD have been significantly improved. develop. This computing architecture with separated computing and storage PoDs has important implications for the...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/20763H05K7/20718H05K7/1488H05K7/2079H05K7/20827H05K7/20745H05K7/20836H05K7/20509H05K7/20136H05K7/20209H05K7/20327
Inventor 高天翼
Owner BAIDU USA LLC
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