Automatic CCD visual inspection equipment for electroplating of lead frame
A visual detection and lead frame technology, applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems of easy missing information, poor lead frame inspection effect, etc., and achieve good detection effect and comprehensive detection effect
Active Publication Date: 2021-11-30
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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Problems solved by technology
[0003] After the lead frame is electroplated, it needs to be visually inspected to check its overall integrity and electroplating effect, which requires the use of CCD visual inspection equipment. The existing equipment is inspected in a static way, and the CCD visual inspection equipment is fixed. Then the pictures presented during the inspection are all two-dimensional plane effects, which makes the inspection effect on the details of the lead frame not good, and it is easy to miss information
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0027] refer to Figure 1-4 , a lead frame electroplating automatic CCD visual inspection equipment, the lead frame electroplating automatic CCD visual inspection equipment includes:
[0028] The console 1 and the fixed table 17 fixedly installed next to the console 1, the conveyor belt 2 for transporting the lead frame is arranged on the console 1;
[0029] The support column 14 that is slidably installed on the fixed platform 17 and the operation panel 5 that is connected with the fixed platform 17, two rows of detection heads 6 are fixedly installed on the bottom of the operation panel 5, and the fixed platform 17 is provided with a moving groove 18, and the suppo...
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The invention discloses automatic CCD visual inspection equipment for electroplating of a lead frame. The automatic CCD visual inspection equipment comprises an operation table, a fixed table fixedly mounted beside the operation table, a supporting column, an operation plate and a moving mechanism; a conveying belt for conveying the lead frame is arranged on the operation table; the supporting column is slidably installed on the fixed table, the operation plate is connected with the fixed table, two rows of detection heads are fixedly installed at the bottom of the operation plate, a moving groove is formed in the fixed table, the lower end of the supporting column is fixedly connected with a sliding block, and the sliding block is slidably arranged in the moving groove; and the moving mechanism is installed on the fixed table and connected with one side of the sliding block, and the moving mechanism is used for pushing the sliding block to slide in the moving groove. According to the automatic CCD visual inspection equipment, through the moving mechanism and a lifting mechanism, detection can be carried out along with the lead frame, the lead frame can be detected closer and more carefully, meanwhile, due to the fact that the device follows with the lead frame, the effective visual detection time of the single lead frame can be prolonged, and the detection effect is better.
Description
technical field [0001] The invention belongs to the technical field of lead frame production, in particular to an automatic CCD visual detection device for lead frame electroplating. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. After the lead frame is formed, its surface needs to be electroplated and packaged to protect the lead frame. . [0003] After the lead frame is electroplated, it needs to be visually inspected to check its overall integrity and electroplating effect, which require...
Claims
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Login to View More IPC IPC(8): C25D7/00C25D17/00C25D21/12
CPCC25D7/00C25D17/00C25D21/12
Inventor 周光明颜海年章挺付巍巍赵清
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD